Samtec ADF6 Series Vertical Surface PCB Socket, 40-Contact, 4 Row, 0.635 mm Pitch Solder
- N° de stock RS:
- 202-7891
- Référence fabricant:
- ADF6-40-03.5-L-4-2-A
- Fabricant:
- Samtec
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 202-7891
- Référence fabricant:
- ADF6-40-03.5-L-4-2-A
- Fabricant:
- Samtec
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Samtec | |
| Product Type | PCB Socket | |
| Number of Contacts | 40 | |
| Number of Rows | 4 | |
| Sub Type | High Density Socket | |
| Pitch | 0.635mm | |
| Current | 1.34A | |
| Termination Type | Solder | |
| Housing Material | Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Vertical | |
| Connector System | Board-to-Board | |
| Stacking Height | 5mm | |
| Voltage | 219 V | |
| Series | ADF6 | |
| Row Pitch | 0.96mm | |
| Minimum Operating Temperature | -55°C | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin over Nickel, Gold | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | EU RoHS, EU REACH, CHINA RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque Samtec | ||
Product Type PCB Socket | ||
Number of Contacts 40 | ||
Number of Rows 4 | ||
Sub Type High Density Socket | ||
Pitch 0.635mm | ||
Current 1.34A | ||
Termination Type Solder | ||
Housing Material Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Vertical | ||
Connector System Board-to-Board | ||
Stacking Height 5mm | ||
Voltage 219 V | ||
Series ADF6 | ||
Row Pitch 0.96mm | ||
Minimum Operating Temperature -55°C | ||
Contact Material Copper Alloy | ||
Contact Plating Tin over Nickel, Gold | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals EU RoHS, EU REACH, CHINA RoHS | ||
- Pays d'origine :
- US
The Samtec Connector is a low profile, ultra-slim surface mount socket. Edge Rate® contact system optimized for signal integrity performance. Supports 56 Gbps PAM4 (28 Gbps NRZ) applications.
Incredibly dense with up to 240 total I/Os
Low profile 5 mm stack height and slim 5 mm width
4-row design; 10 - 60 positions per row (40 - 240 total positions)
Edge Rate® contact system optimized for signal integrity performance
Supports 56 Gbps PAM4 (28 Gbps NRZ) applications
Solder ball technology for simplified processing and self aligning
Additional stack heights and higher pin counts in development
Liens connexes
- Samtec ADF6 Series Vertical Surface PCB Socket 4 Row, 0.635 mm Pitch Solder
- Samtec ADF6 Series Vertical Surface PCB Socket 4 Row, 0.635 mm Pitch Solder
- Samtec ADF6 Series Vertical Surface PCB Socket 4 Row, 0.635 mm Pitch Solder
- Samtec ADF6 Series Vertical Surface PCB Socket 4 Row, 0.635 mm Pitch Solder
- Samtec ADF6 Series Vertical Surface PCB Socket 4 Row, 0.635 mm Pitch Solder
- Samtec ADF6 Series Vertical PCB Socket 4-Row Solder Termination
- Samtec UDF6 Series Vertical Through Hole PCB Header 0.635 mm Pitch Shrouded
- Samtec ADF6 Series Straight Surface PCB Header 0.64 mm Pitch Shrouded
