TE Connectivity Z-PACK HM Series Straight Through Hole PCB Socket, 3-Contact, 2.54 mm Pitch Solder

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Sous-total (1 tube de 60 unités)*

233,52 €

(TVA exclue)

282,54 €

(TVA incluse)

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Dernier stock RS
  • 60 dernière(s) unité(s), prête(s) à l'envoi d'un autre centre de distribution
Unité
Prix par unité
le tube*
60 +3,892 €233,52 €

*Prix donné à titre indicatif

N° de stock RS:
165-0967
Numéro d'article Distrelec:
304-53-047
Référence fabricant:
5-5223955-2
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Socket

Number of Contacts

3

Sub Type

Board-to-Board

Pitch

2.54mm

Current

1.15A

Termination Type

Solder

Housing Material

Liquid Crystal Polymer

Mount Type

Through Hole

Orientation

Straight

Connector System

Board-to-Board

Voltage

250 V

Series

Z-PACK HM

Minimum Operating Temperature

-65°C

Maximum Operating Temperature

125°C

Contact Material

Copper

Contact Plating

Gold

Contact Gender

Female

Standards/Approvals

RoHS

Pays d'origine :
CN

Z-PACK™ HS3 Connectors


The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.

The Z-PACK 2 mm HM Interconnection System is designed as a two part system for the connection of free boards (Daughterboards or PCBs) to fixed boards (Motherboards, Backplane or Backpanel) and feed the connection through the fixed board.

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