TE Connectivity AMPMODU Series Vertical Board Mount PCB Socket, 280-Contact, 2-Row, 0.6mm Pitch, Surface Mount

Sous-total (1 plateau de 6 unités)*

175,27 €

(TVA exclue)

212,08 €

(TVA incluse)

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  • Expédition à partir du 01 avril 2026
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Prix par unité*
1 +175,27 €29,212 €

*Prix donné à titre indicatif

N° de stock RS:
501-537
Référence fabricant:
1-5353729-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

280

Number of Rows

2

Pitch

0.6mm

Type

PCB Mount Receptacle

Mounting Type

Board Mount

Body Orientation

Vertical

Termination Method

Surface Mount

Series

AMPMODU

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle is expertly designed for vertical, board-to-board connectivity, catering specifically to applications requiring a reliable and compact solution. This connector boasts a remarkable 280 positions, allowing for robust signal transmission while maintaining a sleek profile. Crafted with high-quality materials, it features a 0.6 mm centreline pitch, ensuring minimal space usage while supporting an efficient layout on PCBs. The gold-plated contacts enhance durability and performance, making it ideal for demanding environments. With a surface mount design, installation is simplified, promoting faster assembly processes. The product's versatility is complemented by its broad operating temperature range, allowing it to function effectively in various conditions. By focusing on performance and reliability, this receptacle stands out as a premium choice for modern electronic designs.

Supports board-to-board configurations with ease
Designed with stackable features for versatile applications
Utilises high-temperature thermoplastic for housing durability
Ensures effective electrical connections with grounding contacts
Offers a compact footprint while accommodating a high number of positions
Facilitates reflow solder capabilities to enhance manufacturing efficiency
Incorporates a well-defined mating alignment system for error-free connections
Features intrinsic resistance to thermal and environmental extremes

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