TE Connectivity AMPMODU Series Vertical Board PCB Socket, 280-Contact, 2 Row, 0.6 mm Pitch Surface Mount

Voir l’ensemble des PCB Sockets

Sous-total (1 plateau de 6 unités)*

175,27 €

(TVA exclue)

212,08 €

(TVA incluse)

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  • Prêt à être expédié à partir du 31 août 2026
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Prix par unité*
1 +175,27 €29,212 €

*Prix donné à titre indicatif

N° de stock RS:
501-537
Numéro d'article Distrelec:
304-53-526
Référence fabricant:
1-5353729-0
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Number of Contacts

280

Product Type

PCB Socket

Sub Type

PCB Receptacle

Number of Rows

2

Pitch

0.6mm

Current

0.5A

Termination Type

Surface Mount

Housing Material

High Temperature Thermoplastic

Mount Type

Board

Orientation

Vertical

Stacking Height

12mm

Connector System

Board-to-Board

Voltage

50V

Series

AMPMODU

Minimum Operating Temperature

-40°C

Row Pitch

0.6mm

Contact Plating

Gold

Contact Material

Copper Alloy

Maximum Operating Temperature

85°C

Contact Gender

Female

Standards/Approvals

UL 94 V-0

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle is expertly designed for vertical, board-to-board connectivity, catering specifically to applications requiring a reliable and compact solution. This connector boasts a remarkable 280 positions, allowing for robust signal transmission while maintaining a sleek profile. Crafted with high-quality materials, it features a 0.6 mm centreline pitch, ensuring minimal space usage while supporting an efficient layout on PCBs. The gold-plated contacts enhance durability and performance, making it ideal for demanding environments. With a surface mount design, installation is simplified, promoting faster assembly processes. The product's versatility is complemented by its broad operating temperature range, allowing it to function effectively in various conditions. By focusing on performance and reliability, this receptacle stands out as a premium choice for modern electronic designs.

Supports board-to-board configurations with ease

Designed with stackable features for versatile applications

Utilises high-temperature thermoplastic for housing durability

Ensures effective electrical connections with grounding contacts

Offers a compact footprint while accommodating a high number of positions

Facilitates reflow solder capabilities to enhance manufacturing efficiency

Incorporates a well-defined mating alignment system for error-free connections

Features intrinsic resistance to thermal and environmental extremes

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