Molex 50330 Series Vertical Board PCB Socket, 30-Contact, 2 Row, 0.4 mm Pitch Surface Mount
- N° de stock RS:
- 478-193
- Numéro d'article Distrelec:
- 304-62-343
- Référence fabricant:
- 503304-3042
- Fabricant:
- Molex
Sous-total (1 bobine de 9000 unités)*
6 392,46 €
(TVA exclue)
7 734,88 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 80,00 €
Temporairement en rupture de stock
- Expédition à partir du 27 avril 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 6 392,46 € | 0,71 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-193
- Numéro d'article Distrelec:
- 304-62-343
- Référence fabricant:
- 503304-3042
- Fabricant:
- Molex
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Molex | |
| Product Type | PCB Socket | |
| Number of Contacts | 30 | |
| Number of Rows | 2 | |
| Sub Type | PCB Receptacle | |
| Pitch | 0.4mm | |
| Current | 0.3A | |
| Housing Material | Liquid Crystal Polymer | |
| Termination Type | Surface Mount | |
| Mount Type | Board | |
| Orientation | Vertical | |
| Stacking Height | 0.7mm | |
| Voltage | 50 Vrms | |
| Series | 50330 | |
| Row Pitch | 0.4mm | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Contact Plating | Gold | |
| Contact Material | Copper Alloy | |
| Standards/Approvals | RoHS | |
| Sélectionner tout | ||
|---|---|---|
Marque Molex | ||
Product Type PCB Socket | ||
Number of Contacts 30 | ||
Number of Rows 2 | ||
Sub Type PCB Receptacle | ||
Pitch 0.4mm | ||
Current 0.3A | ||
Housing Material Liquid Crystal Polymer | ||
Termination Type Surface Mount | ||
Mount Type Board | ||
Orientation Vertical | ||
Stacking Height 0.7mm | ||
Voltage 50 Vrms | ||
Series 50330 | ||
Row Pitch 0.4mm | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Contact Plating Gold | ||
Contact Material Copper Alloy | ||
Standards/Approvals RoHS | ||
- Pays d'origine :
- JP
The TE Connectivity slim stack board-to-board receptacle showcases an innovative design focused on high retention force and versatility. Ideal for applications requiring reliable signal integrity and durability, this connector features a 0.40mm pitch, making it suitable for compact layouts where space is at a premium. With a mated height of 0.70mm and a width of 2.60mm, it adheres to enhanced performance standards across a variety of electronic applications. The robust construction and thoughtful engineering ensure that the receptacle meets the stringent demands of modern electronic assemblies, providing assurance for integrators and designers alike. Furthermore, compliance with international standards underscores its reliability and performance.
Designed for board-to-board applications, ensuring efficient signal transmission
Constructed from a high-quality copper alloy for superior conductivity
Capable of withstanding a maximum current of 0.3A, ensuring reliability
Boasts a vertical orientation that optimises space-saving in designs
Includes a surface mount termination interface style for versatile installation
Durable design supports up to 30 mating cycles for longevity
Low-halogen material choice promotes environmental compliance
Embossed tape on reel packaging simplifies assembly processes
Liens connexes
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