Molex 503304 Series Vertical Surface PCB Header, 12 Contact(s), 0.4 mm Pitch, 2 Row, Unshrouded

Sous-total (1 bobine de 3000 unités)*

2 021,81 €

(TVA exclue)

2 446,39 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +2 021,81 €0,674 €

*Prix donné à titre indicatif

N° de stock RS:
478-189
Référence fabricant:
503304-1240
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

503304

Pitch

0.4mm

Number of Contacts

12

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Row Pitch

0.4mm

Standards/Approvals

CHINA RoHS, EU RoHS Compliant, IEC-62474, IPC 1752A Class C, IPC 1752A Class D

Distrelec Product Id

304-62-340

Pays d'origine :
JP
The TE Connectivity connector offers exceptional performance in board-to-board connectivity, specifically crafted for applications requiring compact design without compromising on quality or reliability. Designed with a 0.40mm pitch, it facilitates seamless integration while ensuring optimal signal transmission at a stacking height of just 0.70mm. The dual-row configuration provides enhanced density in tight spaces, making it an ideal choice for sophisticated electronic assemblies. With a robust engineering focus, this connector stands out for its compatibility and ease of integration, ensuring that it meets the demanding requirements of modern applications. The product boasts low-halogen materials, catering to strict environmental compliance standards, and reinforces the commitment to sustainability in the electronics industry.

Designed for precision with a 0.40mm pitch configuration

Dual-row setup enables high-density board arrangements

Low-halogen construction aligns with contemporary safety standards

Facilitates smooth integration for various signal applications

Ensures reliable connections with minimal interference

Engineered for durability, supporting long-term performance

Compatible with moulded components for versatile usage

Enhances sustainability through a compliant environmental profile

Streamlined design reduces footprint without sacrificing performance

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