TE Connectivity 2-1658 Series Vertical Board PCB Socket, 80-Contact, 2 Row, 0.8 mm Pitch Solder

Voir l’ensemble des PCB Sockets

Sous-total (1 plateau de 15 unités)*

188,19 €

(TVA exclue)

227,71 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Stocké-e par le fabricant
  • Prêt à être expédié à partir du 18 mai 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +188,19 €12,546 €

*Prix donné à titre indicatif

N° de stock RS:
468-865
Numéro d'article Distrelec:
304-53-762
Référence fabricant:
2-1658462-2
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Number of Contacts

80

Product Type

PCB Socket

Number of Rows

2

Sub Type

PCB Receptacle

Pitch

0.8mm

Current

9.5A

Termination Type

Solder

Housing Material

Liquid Crystal Polymer

Mount Type

Board

Orientation

Vertical

Connector System

Board-to-Board

Voltage

125V

Series

2-1658

Row Pitch

0.8mm

Minimum Operating Temperature

65°C

Contact Plating

Gold

Contact Material

Phosphor Bronze

Contact Gender

Female

Maximum Operating Temperature

125°C

Standards/Approvals

No

Pays d'origine :
CN
The TE Connectivity PCB Mount Receptacle is an expertly designed connectivity solution ideal for board-to-board applications. This connector excels in offering a secure connection with an impressive 80 positions, making it perfect for intricate electronic systems. Crafted for surface mounting, it ensures a robust yet discreet integration into your PCB layout. The fully shrouded design heightens the safety of the connection, while the gold plating enhances durability and reduces signal loss. With an operating voltage of up to 125 VAC, this receptacle efficiently handles both power and signal transmission. Whether in consumer electronics or industrial automation, this component delivers exceptional performance and reliability.

Designed for vertical PCB mounting to maximise space efficiency

Offers a parallel board-to-board configuration for seamless integration

Utilises high-grade materials for enhanced thermal and mechanical resilience

Allows for effortless assembly via pick and place processes

Provides a wide operating temperature range for diverse applications

Employs low halogen materials, promoting a safer environment

Features high mating retention for secure connections during operation

Supports reflow soldering processes, ensuring efficient manufacturing

Liens connexes