Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 4 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 5 unités)*

12,78 €

(TVA exclue)

15,465 €

(TVA incluse)

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Unité
Prix par unité
le paquet*
5 - 952,556 €12,78 €
100 - 3702,038 €10,19 €
375 - 14951,804 €9,02 €
1500 - 29951,68 €8,40 €
3000 +1,614 €8,07 €

*Prix donné à titre indicatif

N° de stock RS:
324-9220
Référence fabricant:
43045-0415
Fabricant:
Molex
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Marque

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Pitch

3mm

Current

5A

Number of Contacts

4

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Brass

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Contact Gender

Male

Maximum Operating Temperature

105°C

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

Distrelec Product Id

304-41-747

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Press fit retention clips for PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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