Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 2 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Offre groupée disponible

Sous-total (1 paquet de 5 unités)*

15,56 €

(TVA exclue)

18,83 €

(TVA incluse)

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  • 125 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
  • Plus 655 unité(s) expédiée(s) à partir du 23 décembre 2025
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Unité
Prix par unité
le paquet*
5 - 953,112 €15,56 €
100 - 3702,578 €12,89 €
375 - 14952,352 €11,76 €
1500 - 29952,258 €11,29 €
3000 +2,166 €10,83 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
670-1897
Référence fabricant:
43045-0218
Fabricant:
Molex
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Marque

Molex

Product Type

PCB Header

Series

Micro-Fit 3.0

Current

5A

Pitch

3mm

Housing Material

Thermoplastic

Number of Contacts

2

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Tin

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Contact Gender

Male

Maximum Operating Temperature

125°C

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

Distrelec Product Id

304-42-657

Pays d'origine :
MX

Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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