Molex Micro-Fit 3.0 Series Straight Surface PCB Header, 8 Contact(s), 3 mm Pitch, 2 Row, Shrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 200 unités)*

458,60 €

(TVA exclue)

555,00 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
En stock
  • 600 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité
Prix par unité
la bobine*
200 +2,293 €458,60 €

*Prix donné à titre indicatif

N° de stock RS:
167-1922
Référence fabricant:
43045-0818
Fabricant:
Molex
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Molex

Product Type

PCB Header

Series

Micro-Fit 3.0

Pitch

3mm

Current

5A

Housing Material

Thermoplastic

Number of Contacts

8

Number of Rows

2

Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Material

Brass

Contact Plating

Tin

Termination Type

Solder

Row Pitch

3mm

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Contact Gender

Male

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

250 V

Molex Micro-Fit 3.0 3.0mm Dual Row SMT Headers with Solder Tabs, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Solder tabs for secure connection to PCB

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


Liens connexes