Molex 55560 Series Vertical Surface Mount Plug, 60 Contact(s), 0.5 mm Pitch, 2 Row, Shrouded

Sous-total (1 bobine de 3000 unités)*

7 025,90 €

(TVA exclue)

8 501,34 €

(TVA incluse)

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Bobine(s)
la bobine
Prix par unité*
1 +7 025,90 €2,342 €

*Prix donné à titre indicatif

N° de stock RS:
691-728
Référence fabricant:
55560-0607
Fabricant:
Molex
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Marque

Molex

Series

55560

Product Type

Plug

Pitch

0.5mm

Current

0.5A

Number of Contacts

60

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface Mount

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

105°C

Standards/Approvals

RoHS Compliant

Pays d'origine :
CN
The Molex SlimStack Plug is a highly efficient connector designed specifically for board-to-board applications, featuring a 0.50mm pitch that ensures seamless integration in Compact environments. This robust connector offers a dual-row, vertical orientation with a notable stack height of 1.50mm, making it Ideal for modern electronic devices that require reliable signal transmission and space-saving solutions. With a capacity to support up to 60 circuits, the SlimStack Plug is tailored for versatility in a variety of applications, ensuring optimal performance and compliance with industry standards, including EU RoHS. Its design not only prioritises electrical integrity with a maximum current of 0.5A and a voltage up to 50V but also favours ease of integration with surface mount technology. Enhance your projects with this dependable connector for unyielding connectivity in today's high-tech landscape.

Dual row structure optimises space and connectivity options
Surface mount design facilitates efficient assembly on PCBs
Supports up to 60 circuits, enabling extensive signal routing
Vertical orientation allows for effective use in confined designs
Defined stack height of 1.50mm reduces profile limits in devices
Low-halogen status meets environmental compliance standards
Locking mechanism provides secure connection during operation

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