Molex 5560 Series Vertical Surface PCB Header, 30 Contact(s), 0.5 mm Pitch, 2 Row, Shrouded

Sous-total (1 bobine de 3000 unités)*

2 675,93 €

(TVA exclue)

3 237,88 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +2 675,93 €0,892 €

*Prix donné à titre indicatif

N° de stock RS:
476-458
Référence fabricant:
55560-0307
Fabricant:
Molex
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Marque

Molex

Series

5560

Product Type

PCB Header

Pitch

0.5mm

Current

0.5A

Number of Contacts

30

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Row Pitch

0.5mm

Maximum Operating Temperature

105°C

Tail Pin Length

0.74mm

Standards/Approvals

chemSHERPA, EU RoHS, IEC 61249-2-21, IEC-62474, IPC 1752A Class C, IPC 1752A Class D, REACH SVHC, UL E29179

Voltage

5 V

Distrelec Product Id

304-57-494

Pays d'origine :
CN
The TE Connectivity cutting-edge connector specifically engineered for board-to-board applications. This innovative solution stands out with its detailed craftsmanship and high specifications, ensuring reliable connections in a multitude of electronic devices. Designed for versatility, it accommodates a 0.50mm pitch and dual-row configuration, enabling a seamless integration into compact spaces while maintaining optimal performance. The connector's robust build, featuring surface mount technology and a unique 1.50mm stack height, supports up to 30 circuits. With its low-halogen compliance and excellent environmental ratings, this connector aligns with modern sustainability demands, making it a trustworthy choice for engineers and manufacturers alike. Elevate your connectivity solutions with a product that blends reliability, efficiency, and eco-friendliness.

Precision-engineered for reliable board-to-board connections

Dual-row configuration facilitates compact installations

Low-halogens status ensures compliance with environmental standards

Surface mount design offers ease of assembly and space-saving benefits

Durable resin material withstands high-temperature applications

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