Phoenix Contact DMCV Series Wave Soldering Mount PCB Header, 38 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

Sous-total (1 paquet de 50 unités)*

854,34 €

(TVA exclue)

1 033,75 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 09 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +854,34 €17,087 €

*Prix donné à titre indicatif

N° de stock RS:
556-177
Référence fabricant:
1053861
Fabricant:
Phoenix Contact
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

Phoenix Contact

Series

DMCV

Product Type

PCB Header

Current

8A

Pitch

3.5mm

Number of Contacts

38

Housing Material

Polybutylene Terephthalate

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON DFMC 1

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Row Pitch

3.5mm

Minimum Operating Temperature

-40°C

Termination Type

Solder Pin

Maximum Operating Temperature

100°C

Tail Pin Length

3.5mm

Contact Gender

Male

Mating Pin Length

3.5mm

Standards/Approvals

cULus Recognised

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact PCB header, part of the DMCV 1.5/-G1 series, redefines versatility and efficiency in connection technologies. Designed to accommodate a nominal current of 8 A and a rated voltage of 160 V, it expertly combines robust electrical performance with compact dimensions, making it ideal for applications where space is a premium. The innovative multi-level conductor connection enhances contact density, facilitating a more efficient layout on your PCB. Crafted from durable materials, the component ensures reliability, even in demanding environments. Whether deployed in automation or control technology, this header simplifies connections while adhering to global standards, proving to be a dependable choice for engineers and technicians alike. Available in a practical packing unit, it’s a must-have for your project needs.

Compact design optimises space without sacrificing performance

Multi-level connection enhances contact density for efficient layouts

Robust materials provide excellent durability for demanding applications

Standardised mounting principles ensure ease of installation worldwide

WEEE/RoHS compliant, supporting eco-friendly initiatives

Liens connexes