Phoenix Contact DMCV Series Wave Soldering Mount PCB Header, 40 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

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Sous-total (1 paquet de 50 unités)*

899,30 €

(TVA exclue)

1 088,15 €

(TVA incluse)

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  • Expédition à partir du 09 mars 2026
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le paquet
Prix par unité*
1 +899,30 €17,986 €

*Prix donné à titre indicatif

N° de stock RS:
556-065
Référence fabricant:
1053862
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Series

DMCV

Product Type

PCB Header

Pitch

3.5mm

Current

8A

Housing Material

Polybutylene Terephthalate

Number of Contacts

40

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

COMBICON DFMC 1

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Minimum Operating Temperature

-40°C

Row Pitch

3.5mm

Termination Type

Solder

Contact Gender

Male

Tail Pin Length

3.5mm

Maximum Operating Temperature

100°C

Standards/Approvals

cULus Recognised

Mating Pin Length

3.5mm

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact PCB header is the ultimate solution for high-density connections on your printed circuit board. Designed with precision engineering, this product ensures reliable performance while managing increased contact density without compromising on space. Its vertical connection feature allows for a multi-row arrangement, making it ideal for applications where layout flexibility is essential. Built from high-quality materials and compliant with stringent industry standards, this connector is suited for various mounting methods, primarily wave soldering, and is thus versatile enough for a range of designs. Enhance your PCB assembly with this efficient, compact solution capable of supporting demanding electrical requirements, making it a staple in modern electronic applications.

Compact design optimises space across your application

Vertical connections allow for easy multi-row arrangements

Robust construction ensures long-lasting reliability

Compliant with both WEEE and RoHS directives

Designed for wave soldering, streamlining the assembly process

Offers superior contact density for enhanced connectivity

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