Phoenix Contact DD31H Series Wave Soldering Mount PCB Header, 18 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded

Sous-total (1 paquet de 50 unités)*

348,30 €

(TVA exclue)

421,44 €

(TVA incluse)

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  • Expédition à partir du 30 mars 2026
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le paquet
Prix par unité*
1 +348,30 €6,966 €

*Prix donné à titre indicatif

N° de stock RS:
521-616
Référence fabricant:
1341417
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Series

DD31H

Current

8A

Pitch

3.81mm

Housing Material

Polybutylene Terephthalate

Number of Contacts

18

Number of Rows

2

Shrouded/Unshrouded

Shrouded

Connector System

CONNEXIS

Mount Type

Wave Soldering Mount

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Minimum Operating Temperature

-55°C

Termination Type

Solder

Row Pitch

3.81mm

Tail Pin Length

3.8mm

Contact Gender

Male

Maximum Operating Temperature

105°C

Mating Pin Length

3.8mm

Standards/Approvals

No

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact PCB header from the DD31H series offers a reliable connection solution for various electronic applications. Designed to accommodate up to 18 positions with a 3.81 mm pitch, it is ideally suited for both standard and compact arrangements on a PCB. The sturdy construction ensures durability, while the intuitive snap-in locking mechanism enhances user experience by preventing accidental disconnections. With its black housing and wave-soldering capability, this product combines aesthetics with practicality, effectively meeting the needs of modern electronic designs.

The vertical connection allows for efficient multi-row arrangements

Easy replacement of PCBs is facilitated by the use of plug-in modules

A well-known mounting principle ensures compatibility across various applications

High packing density is achieved with double-row contact arrangements

The design includes a robust locking mechanism to secure connections

WEEE/RoHS compliance guarantees environmental safety

The product is optimised for wave soldering, streamlining assembly processes

Rated for an operational temperature range suitable for demanding environments

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