Phoenix Contact D31H Series Wave Soldering Mount PCB Header, 6 Contact(s), 3.81 mm Pitch, 1 Row, Shrouded

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Sous-total (1 paquet de 50 unités)*

116,56 €

(TVA exclue)

141,04 €

(TVA incluse)

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  • Expédition à partir du 05 mars 2026
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Paquet(s)
le paquet
Prix par unité*
1 +116,56 €2,331 €

*Prix donné à titre indicatif

N° de stock RS:
521-609
Référence fabricant:
1341130
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Series

D31H

Current

8A

Pitch

3.81mm

Housing Material

Polybutylene Terephthalate

Number of Contacts

6

Number of Rows

1

Shrouded/Unshrouded

Shrouded

Mount Type

Wave Soldering Mount

Connector System

CONNEXIS

Contact Plating

Tin Plated

Contact Material

Copper Alloy

Row Pitch

3.81mm

Termination Type

Solder

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

105°C

Tail Pin Length

3.8mm

Standards/Approvals

No

Mating Pin Length

3.8mm

Voltage

160 V

Pays d'origine :
CN
The Phoenix Contact D31H 2.2/ 6-V-3.81-Y PCB header is a versatile and robust solution designed to meet the demands of modern electronic connectivity. Engineered for ease of use, this component features a straightforward snap-in locking mechanism that enhances stability and reliability during operation. With a compact design and linear pinning, it allows for efficient space utilisation on PCBs. This PCB header is compatible with the CONNEXIS D plug-in system, making it an excellent choice for various applications. Its durable construction ensures long-lasting performance, complemented by compliance with international standards for safe and effective usage even in challenging environments.

Features a snap-in locking mechanism for added security

Designed for easy PCB replacement with plug-in modules

Optimised for wave soldering to simplify assembly processes

Black housing provides a sleek and professional appearance

Certifications ensure compliance with industry standards

Lightweight design aids in reducing overall product weight

RoHS compliant, reflecting commitment to environmental sustainability

Efficient heat dissipation to maintain performance under load

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