TE Connectivity AMPMODU Series Vertical Through Hole PCB Header, 10 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 bobine de 25000 unités)*

1 684,85 €

(TVA exclue)

2 038,67 €

(TVA incluse)

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  • Expédition à partir du 27 avril 2026
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Bobine(s)
la bobine
Prix par unité*
1 +1 684,85 €0,067 €

*Prix donné à titre indicatif

N° de stock RS:
520-564
Numéro d'article Distrelec:
304-54-166
Référence fabricant:
5-146858-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Number of Contacts

10

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Through Hole

Contact Material

Copper Alloy

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Contact Gender

Male

Maximum Operating Temperature

105°C

Tail Pin Length

2.79mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Pays d'origine :
MX
The TE Connectivity PCB Mount Header is expertly designed for vertical board-to-board connections, featuring a 10-position configuration with a precise 2.54 mm centreline. Its breakaway design ensures flexibility in various applications, allowing for easy installation on printed circuit boards. Built with a gold-plated contact, this connector promotes superior conductivity and reliability, essential for high-performance electronic systems. The thermoplastic housing provides durability while accommodating a wide operating temperature range, making it suitable for demanding environments. With a termination method of through hole solder, it guarantees secure and stable connections. Designed for compatibility with approved industry standards, this product is an excellent choice for engineers seeking dependable interconnect solutions.

Vertical mounting ensures efficient use of space within enclosures

Breakaway design allows for tailored configurations as per project needs

Nickel contact underplating enhances durability and improves electrical performance

Parallel board-to-board configuration simplifies layout design

Housing material is resistant to high temperatures, ensuring longevity

Low halogen content indicates compliance with environmental standards

Compatible with a variety of standard products, streamlining assembly

Designed for both signal circuit applications and robust electronic requirements

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