TE Connectivity AMPMODU Series Vertical Board PCB Header, 3 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 tube de 146 unités)*

254,83 €

(TVA exclue)

308,34 €

(TVA incluse)

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Temporairement en rupture de stock
  • Expédition à partir du 23 février 2026
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Tube(s)
le tube
Prix par unité*
1 +254,83 €1,745 €

*Prix donné à titre indicatif

N° de stock RS:
505-890
Référence fabricant:
5-146132-1
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Copper Alloy

Number of Contacts

3

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Tail Pin Length

2.29mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Pays d'origine :
MX
The TE Connectivity PCB Mount Header represents an innovative solution designed to facilitate seamless board-to-board connections. This product is crafted for efficient use in electronic circuits, providing superior reliability in signal transmission. Its vertical orientation permits a streamlined installation process, ensuring that your assemblies remain tidy and well-organised. With its breakaway header type, it's engineered to maximise space while providing optimal electrical performance. Made from durable materials, this connector withstands various operating conditions, making it suitable for diverse applications. Its well-considered dimensions and specifications demonstrate a careful design approach aimed at enhancing usability across a broad range of products.

Designed for PCB mounting, ensuring a secure and stable connection

Breakaway feature allows for versatile configurations in tight spaces

Constructed from premium materials for enhanced durability and longevity

Optimised for signal transmission, improving overall performance

Solder process capability accommodates advanced manufacturing techniques

Low halogen content aligns with environmental compliance standards

Compatible with a range of applications, promoting widespread usability

Efficient heat dissipation ensures reliable electrical operation

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