TE Connectivity AMPMODU Series Vertical Board PCB Header, 12 Contact(s), 2.54 mm Pitch, 2 Row, Shrouded

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Sous-total (1 plateau de 65 unités)*

202,87 €

(TVA exclue)

245,47 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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1 +202,87 €3,121 €

*Prix donné à titre indicatif

N° de stock RS:
505-960
Référence fabricant:
5-103169-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

12

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Termination Type

Solder

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Tail Pin Length

3.18mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

750 Vrms

Pays d'origine :
US
The TE Connectivity PCB Mount Header is designed for seamless board-to-board connectivity, featuring a vertical orientation that enhances space efficiency. With its 12 positions arranged on a precise 2.54 mm centreline, this fully shrouded connector is tailored for reliable performance in demanding applications. Crafted with premium materials, including gold-plated contacts and a robust thermoplastic housing, this component ensures superior durability and signal integrity. It meets stringent industry standards and is suited for a wide range of operating conditions. Whether you need to maintain signal integrity in a compact design or require a dependable connection for your PCBs, this connector is engineered to deliver unparalleled performance.

Designed for optimal board-to-board signal transmission

Features a fully shrouded header type to prevent misalignment

Constructed to withstand a diverse operating temperature range

Provides high insulation resistance for enhanced reliability

Incorporates nickel underplating for increased durability

Offers a standard connector profile that fits common design requirements

Utilises a detent window for stable mating retention

Suitable for use with multiple connector assembly types in the AMPMODU series

Compatible with wave soldering processes for ease of manufacturing

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