TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Voir l’ensemble des PCB Headers

Sous-total (1 paquet de 65 unités)*

205,54 €

(TVA exclue)

248,70 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +205,54 €3,162 €

*Prix donné à titre indicatif

N° de stock RS:
505-894
Référence fabricant:
5-146256-7
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

14

Housing Material

Thermoplastic

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.05mm

Standards/Approvals

No

Voltage

30 V

Pays d'origine :
US
The TE Connectivity PCB Mount Header is a premium connectivity solution designed for board-to-board applications. Its vertical orientation and breakaway feature provide exceptional versatility for various configurations, making it ideal for modern electronic devices. With 14 positions and a compact 2.54 mm centreline, it accommodates high-density connectivity needs without compromising performance. The combination of gold contact plating and nickel underplating ensures reliable electrical performance and longevity, while its thermoplastic housing withstands challenging operating conditions. Designed for ease of integration, this connector promises to elevate your project with its robust and dependable design.

Vertical orientation enhances space efficiency in PCB layouts

Breakaway design allows for flexible assembly options

Accommodates up to 14 positions, suitable for compact applications

Gold plating ensures superior conductivity and corrosion resistance

Nickel underplating adds durability and reliability

Thermoplastic housing offers protection against environmental factors

Compatible with high-density circuit designs, ensuring versatility

Easily integrates into existing systems for seamless upgrades

Designed for through-hole solder termination, simplifying installation

Robust mechanical attachment supports secure and stable connections

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