TE Connectivity AMPMODU Series Vertical Board PCB Header, 10 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Sous-total (1 paquet de 150 unités)*

233,91 €

(TVA exclue)

283,03 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Paquet(s)
le paquet
Prix par unité*
1 +233,91 €1,559 €

*Prix donné à titre indicatif

N° de stock RS:
476-723
Référence fabricant:
5-146256-5
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

10

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Termination Type

Solder

Maximum Operating Temperature

105°C

Tail Pin Length

3.05mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-50-877

Pays d'origine :
MX
The TE Connectivity PCB mount header exemplifies innovation in connector design, providing reliable vertical connectivity for board-to-board applications. Ideal for compact electronic devices, it accommodates up to 10 positions with a practical 2.54 mm centreline, ensuring efficient space utilisation. Constructed with gold-plated contacts and a robust thermoplastic housing, this component facilitates an enduring connection while maintaining signal integrity. The breakaway feature simplifies component handling, while through-hole solder termination enhances durability during a multitude of soldering processes. This versatile header is perfect for those seeking dependable performance in demanding environments, all while conforming to industry standards and regulations.

Designed for easy integration in board-to-board applications

Breakaway design allows for flexible configurations

Robust thermoplastic housing ensures durability under harsh conditions

Gold plating on contacts provides optimum conductivity and corrosion resistance

Compact for efficient space management in electronic assemblies

Compatible with various industry standards for reliable performance

Liens connexes