Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 20 Contact(s), 3.81 mm Pitch, 2 Row, Shrouded
- N° de stock RS:
- 492-770
- Référence fabricant:
- 1750313
- Fabricant:
- Phoenix Contact
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- N° de stock RS:
- 492-770
- Référence fabricant:
- 1750313
- Fabricant:
- Phoenix Contact
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Phoenix Contact | |
| Series | MCDNV | |
| Product Type | PCB Header | |
| Pitch | 3.81mm | |
| Current | 8A | |
| Number of Contacts | 20 | |
| Housing Material | Liquid Crystal Polymer | |
| Number of Rows | 2 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Shrouded | |
| Mount Type | Wave Soldering Mount | |
| Connector System | 5 MCDN 1, COMBICON FMC 1 | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin Plated | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3.81mm | |
| Maximum Operating Temperature | 100°C | |
| Contact Gender | Male | |
| Tail Pin Length | 2.6mm | |
| Standards/Approvals | cULus Recognised, VDE | |
| Mating Pin Length | 2.6mm | |
| Voltage | 160V | |
| Sélectionner tout | ||
|---|---|---|
Marque Phoenix Contact | ||
Series MCDNV | ||
Product Type PCB Header | ||
Pitch 3.81mm | ||
Current 8A | ||
Number of Contacts 20 | ||
Housing Material Liquid Crystal Polymer | ||
Number of Rows 2 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Shrouded | ||
Mount Type Wave Soldering Mount | ||
Connector System 5 MCDN 1, COMBICON FMC 1 | ||
Contact Material Copper Alloy | ||
Contact Plating Tin Plated | ||
Termination Type Solder | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3.81mm | ||
Maximum Operating Temperature 100°C | ||
Contact Gender Male | ||
Tail Pin Length 2.6mm | ||
Standards/Approvals cULus Recognised, VDE | ||
Mating Pin Length 2.6mm | ||
Voltage 160V | ||
- Pays d'origine :
- DE
The Phoenix Contact PC Board header is designed to offer exceptional versatility in electronic device connections, integrating seamlessly into the modern SMT soldering process. With its compact design, it allows for a tailored fit on PCBs, enhancing the overall device layout. The product features an efficient pin layout and boasts a robust construction that's compatible with multiple connection technologies, allowing for a streamlined assembly process. Its remarkable specifications ensure high reliability and performance under various operational conditions, supporting a nominal current of 8 A and rated voltage up to 160 V. Whether you are developing new devices or upgrading existing designs, this PCB header balances efficient space utilisation with high-performance standards, delighting engineers and product developers alike.
Facilitates vertical connection arrangements for multi-row setups
Solder pins designed for simple integration and reliability
Provides maximum flexibility for diverse connector technologies
Composed of materials meeting WEEE/RoHS compliance standards
Supports installation using reflow and wave soldering processes
Developed for high-density PCB applications without compromising performance
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