Phoenix Contact MCDNV Series Vertical Wave Soldering Mount PCB Header, 6 Contact(s), 3.5 mm Pitch, 2 Row, Shrouded

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Sous-total (1 paquet de 95 unités)*

305,92 €

(TVA exclue)

370,16 €

(TVA incluse)

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  • Expédition à partir du 18 mai 2026
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le paquet
Prix par unité*
1 +305,92 €3,22 €

*Prix donné à titre indicatif

N° de stock RS:
488-993
Référence fabricant:
1952791
Fabricant:
Phoenix Contact
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Marque

Phoenix Contact

Product Type

PCB Header

Series

MCDNV

Pitch

3.5mm

Current

8A

Number of Contacts

6

Housing Material

Liquid Crystal Polymer

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Connector System

COMBICON FMC 1

Mount Type

Wave Soldering Mount

Contact Material

Copper Alloy

Contact Plating

Tin Plated

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3.5mm

Maximum Operating Temperature

100°C

Contact Gender

Male

Tail Pin Length

2.6mm

Standards/Approvals

cULus Recognised, VDE

Mating Pin Length

2.6mm

Pays d'origine :
DE
The Phoenix Contact PCB header from the MCDNV 1.5/-G1-THR series is designed for optimal integration into modern electronic assemblies. With a pitch of 3.5 mm and a robust construction, it supports a nominal current of 8 A, ensuring reliable performance across various applications. The vertical connection design facilitates multi-row arrangements on PCBs, maximising space efficiency while maintaining a high degree of freedom for device design. Featuring a black housing, this component is constructed from durable materials, making it suitable for both THR soldering and wave soldering processes. Ideal for connectors utilising diverse connection technologies, it allows for increased contact density through its conductor connection on multiple levels. This product perfectly blends versatility and reliability, making it an excellent choice for engineers and manufacturers alike.

Designed for seamless integration into SMT soldering processes

Facilitates multi-row arrangements to optimise PCB layout

Compatible with various connection technologies for versatile applications

Enables higher contact density with conductors operating across several levels

Constructed from reliable materials that comply with RoHS standards

Ideal for both reflow and wave soldering applications

Features a pin layout that supports linear pinning for enhanced stability

Packed in cardboard for eco-friendly and secure delivery

Accompanied by comprehensive user information and design guidelines

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