TE Connectivity AMPMODU Series Vertical Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Sous-total (1 bobine de 250 unités)*

525,26 €

(TVA exclue)

635,56 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Bobine(s)
la bobine
Prix par unité*
1 +525,26 €2,101 €

*Prix donné à titre indicatif

N° de stock RS:
482-175
Référence fabricant:
5-147279-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Housing Material

Glass Filled Liquid Crystal Polymer

Number of Contacts

4

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Copper Alloy

Contact Plating

Gold

Termination Type

Surface Mount

Minimum Operating Temperature

65°C

Row Pitch

2.54mm

Maximum Operating Temperature

105°C

Contact Gender

Male

Standards/Approvals

2016, China RoHS 2 Directive MIIT Order No 32, EU ELV Directive 2000/53/EC Compliant, EU RoHS Directive 2011/65/EU Compliant, UL 94V-0

Distrelec Product Id

304-50-899

Pays d'origine :
US
The TE Connectivity PCB mount header is designed for vertical board-to-board connections, featuring a robust 4-position layout on a 2.54 mm centreline. Engineered to deliver high reliability, it incorporates a breakaway functionality ideal for streamlined assembly processes. With a surface mount design, this component supports signal applications, making it a preferred choice in various electronic assemblies. The header is crafted from high-quality materials that ensure optimal performance and durability, even in demanding environments. Designed to meet industry standards, it ensures compatibility and compliance while offering a straightforward solution for your PCB connectivity needs.

Vertical orientation optimises space on your PCB

Breakaway design simplifies the assembly process

Nickel underplating enhances contact durability

Surface mount technology offers ease of handling during production

Low-temperature solder capability allows compatibility with a variety of soldering applications

Signal application focus ensures reliable communication between circuit boards

Black colour ensures clear visibility of solder joints

Parallel board-to-board configuration accommodates diverse layout requirements

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