TE Connectivity AMPMODU Series Right Angle Board PCB Header, 3 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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Sous-total (1 paquet de 100 unités)*

281,47 €

(TVA exclue)

340,58 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +281,47 €2,815 €

*Prix donné à titre indicatif

N° de stock RS:
482-022
Référence fabricant:
3-102203-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2.54mm

Current

3A

Number of Contacts

3

Housing Material

Thermoplastic

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Board-to-Board

Mount Type

Board

Contact Material

Phosphor Bronze

Contact Plating

Gold

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

2.79mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL E28476

Voltage

750 Vrms

Distrelec Product Id

304-50-645

Pays d'origine :
MX
The TE Connectivity PCB Mount Header, designed for right-angle board-to-board connections, exemplifies precision and reliability. Its compact three-position design optimizes space while ensuring secure connectivity in various applications. Fully shrouded and featuring gold contacts, this header is engineered for high-performance tasks, making it an ideal choice for modern electronic assemblies. The robust thermoplastic housing and nickel underplaying contribute to its enduring quality, supporting signals reliably across a wide operational temperature range. Engineers and technicians will appreciate the ease of solder installation, as well as the compatibility with industry standards, making this component a staple for demanding tasks in various sectors.

Compact right-angle design enhances layout flexibility

Fully shrouded contacts provide exceptional protection during installation

Gold contact plating ensures superior conductivity and corrosion resistance

Robust housing material guarantees long-lasting durability under various conditions

Nickel underplaying enhances contact performance for reliable connectivity

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