TE Connectivity AMPMODU Series Right Angle Board PCB Header, 4 Contact(s), 2.54 mm Pitch, 1 Row, Shrouded

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N° de stock RS:
479-999
Numéro d'article Distrelec:
304-53-605
Référence fabricant:
103672-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Pitch

2.54mm

Current

3A

Housing Material

Thermoplastic

Number of Contacts

4

Number of Rows

1

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Board

Connector System

Wire-to-Board

Contact Plating

Tin Lead

Contact Material

Brass

Row Pitch

2.54mm

Termination Type

Solder

Minimum Operating Temperature

65°C

Tail Pin Length

3.3mm

Maximum Operating Temperature

105°C

Mating Pin Length

5.84mm

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

60 V

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB mount header is a highly versatile component designed for efficient wire-to-board connections in complex electronic assemblies. With its right-angle orientation and fully shrouded design, this connector provides a secure and reliable interface for your applications. Ideal for PCB applications where space is at a premium, it is engineered for soldering to a printed circuit board, ensuring a robust electrical connection. Whether used in telecommunications, consumer electronics, or automotive applications, this header meets stringent industry standards, delivering unmatched performance and durability in harsh environments.

Right-angle orientation allows for effective space utilization on PCBs

Fully shrouded design enhances protection against accidental connections

Optimized electrical characteristics support high-performance signal transmission

Robust housing material ensures longevity and reliability in various conditions

Tin-lead plating offers superior corrosion resistance for enduring applications

Solder termination method simplifies assembly processes in manufacturing

Lightweight and compact structure contributes to overall system efficiency

Mechanical alignment features facilitate hassle-free mating with compatible components

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