TE Connectivity AMPMODU Series Vertical Board PCB Header, 14 Contact(s), 2.54 mm Pitch, 2 Row, Unshrouded

Sous-total (1 paquet de 150 unités)*

237,09 €

(TVA exclue)

286,88 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Paquet(s)
le paquet
Prix par unité*
1 +237,09 €1,581 €

*Prix donné à titre indicatif

N° de stock RS:
480-993
Référence fabricant:
5-146254-7
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU

Product Type

PCB Header

Current

3A

Pitch

2.54mm

Housing Material

Thermoplastic

Number of Contacts

14

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Board

Connector System

Board-to-Board

Contact Plating

Tin Plated

Contact Material

Phosphor Bronze

Row Pitch

2.54mm

Minimum Operating Temperature

65°C

Termination Type

Solder

Tail Pin Length

3.05mm

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL 94V-0, UL E28476

Voltage

30 V

Distrelec Product Id

304-50-874

Pays d'origine :
MX
The TE Connectivity PCB Mount Header offers a robust solution for board-to-board connectivity, ideal for demanding electronic applications. Designed with a vertical orientation and a breakaway header type, it efficiently accommodates 14 positions on a 2.54 mm centreline, ensuring a secure fit in your electronic assemblies. The header's through-hole solder design makes installation straightforward, while its durable construction is complemented by a sleek black thermoplastic housing. Designed to operate in high-stress environments, this connector supports operating temperatures from -65 to 105 °C, ensuring reliability under diverse conditions. With compatibility to various industry standards, this product exemplifies both performance and versatility for your connectivity needs, making it a trusted choice for engineers seeking reliable solutions in their projects.

Designed for easy integration into PCB assemblies

Features a breakaway design for flexible configuration

Suitable for fully loaded connector contact load conditions

Utilises nickel and tin underplating for enhanced conductivity

Optimised for through-hole solder termination for strong attachment

Constructed from high-quality thermoplastic for durability

Configured for parallel board-to-board connections

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