TE Connectivity AMPMODU Series Vertical PCB PCB Header, 14 Contact(s), 2 mm Pitch, 2 Row, Unshrouded

Sous-total (1 tube de 123 unités)*

285,94 €

(TVA exclue)

345,99 €

(TVA incluse)

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  • Expédition à partir du 27 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +285,94 €2,325 €

*Prix donné à titre indicatif

N° de stock RS:
476-755
Référence fabricant:
2842131-7
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

2A

Pitch

2mm

Number of Contacts

14

Housing Material

Polyamide Fibreglass

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

PCB

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Brass

Termination Type

Solder

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Tail Pin Length

2.8mm

Maximum Operating Temperature

125°C

Standards/Approvals

UL 94V-0, UL E28476, UL Recognised

Mating Pin Length

4mm

Voltage

125 V

Distrelec Product Id

304-53-956

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is designed to streamline board-to-board connections with precision and reliability. Featuring a vertical orientation, this connector offers an impressive 14-position configuration with a compact 2 mm centerline pitch. Ideal for applications where space is at a premium, it boasts a breakaway header type for easy assembly and disassembly. Crafted from durable materials, the header is equipped with gold-plated contacts, ensuring superior conductivity and resistance to corrosion. This versatile connector is suitable for various electronic applications, including signal transmission, making it an essential component for modern circuit designs. With capabilities for through-hole soldering, it promises a strong mechanical bond and electrical performance across diverse environments.

Designed for efficient board-to-board communication

Breakaway configuration simplifies assembly processes

Durable thermoplastic housing withstands demanding conditions

High dielectric withstand voltage enhances safety and functionality

Compact footprint maximizes space efficiency in circuit designs

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