TE Connectivity AMPMODU Series Vertical PCB PCB Header, 5 Contact(s), 2 mm Pitch, 1 Row, Unshrouded

Sous-total (1 tube de 174 unités)*

230,30 €

(TVA exclue)

278,66 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +230,30 €1,324 €

*Prix donné à titre indicatif

N° de stock RS:
474-916
Référence fabricant:
2355184-5
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Pitch

2mm

Current

2A

Housing Material

Polyamide Fibreglass

Number of Contacts

5

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

PCB

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Termination Type

Solder

Row Pitch

2mm

Minimum Operating Temperature

-40°C

Tail Pin Length

2.8mm

Maximum Operating Temperature

125°C

Standards/Approvals

China RoHS 2, EU ELV, EU REACH, EU RoHS, UL 94V-0, UL E28476

Mating Pin Length

4mm

Voltage

125 V

Distrelec Product Id

304-53-909

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is designed to deliver reliable electrical connections in compact electronic assemblies. With a vertical orientation and a 5-position layout, this connector provides an efficient solution for board-to-board applications, ensuring optimal signal integrity. Constructed from high-quality thermoplastic materials, it features breakaway capabilities for easy integration into various designs. The gold plating on mating areas enhances conductivity, making it perfect for demanding environments. This connector supports a range of operating conditions, showcasing its versatility for high-performance applications. Its thoughtful design includes features tailored for seamless soldering and durability in circuit board assemblies, solidifying its place in the toolkit of modern electronic engineers.

Optimised for board to board configurations to streamline interconnect designs

Breakaway design facilitates easy removal while maintaining secure connections

High quality thermoplastic housing ensures resilience against rugged operating conditions

Gold plating on contact areas enhances performance and extends service life

Compact design helps save valuable space on densely populated circuit boards

Vertical orientation provides a neat and efficient layout for assembly

Designed to withstand a broad operating temperature range ensuring reliability

Suitable for high voltage applications contributing to diverse product uses

Liens connexes