TE Connectivity AMPMODU Series Vertical PCB PCB Header, 4 Contact(s), 2 mm Pitch, 1 Row, Unshrouded

Sous-total (1 tube de 216 unités)*

221,95 €

(TVA exclue)

268,56 €

(TVA incluse)

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  • Expédition à partir du 06 avril 2026
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Tube(s)
le tube
Prix par unité*
1 +221,95 €1,028 €

*Prix donné à titre indicatif

N° de stock RS:
468-463
Numéro d'article Distrelec:
304-64-023
Référence fabricant:
2355184-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Product Type

PCB Header

Series

AMPMODU

Current

2A

Pitch

2mm

Number of Contacts

4

Housing Material

Polyamide Fibreglass

Number of Rows

1

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

PCB

Connector System

Board-to-Board

Contact Material

Brass

Contact Plating

Gold

Minimum Operating Temperature

-40°C

Row Pitch

2mm

Termination Type

Solder

Maximum Operating Temperature

125°C

Tail Pin Length

2.8mm

Standards/Approvals

UL 94 V-0

Mating Pin Length

4mm

Voltage

125 V

Pays d'origine :
CN
The TE Connectivity PCB Mount Header is an essential component designed for seamless board-to-board connections, enhancing reliability and performance in electronic applications. Crafted for vertical mounting and featuring a four-position layout, it supports a 2 mm centreline for compact configurations. This component is well-suited for high-volume production, offering breakaway functionality that ensures versatility during assembly and use. With gold plating for exceptional conductivity and durability, it withstands a range of operating conditions, proving its worth in various industries. This header not only simplifies the design process but also ensures robust signal integrity, making it an ideal choice for sophisticated PCB designs.

Ideal for high density applications and efficient space utilisation

Offers improved thermal management through its thermoplastic body

Facilitates easy installation with a through hole solder termination method

Designed to handle high voltage operations safely and effectively

Corrosion resistant materials enhance longevity and performance in adverse environments

Supports standardised configurations for compatibility with various systems

Reliable mating characteristics ensure consistent connectivity and performance

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