TE Connectivity AMPMODU 50/50 Grid Series Vertical Surface PCB Header, 20 Contact(s), 1.27 mm Pitch, 2 Row, Unshrouded

Sous-total (1 tube de 62 unités)*

334,17 €

(TVA exclue)

404,35 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 26 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +334,17 €5,39 €

*Prix donné à titre indicatif

N° de stock RS:
474-238
Référence fabricant:
104652-2
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Series

AMPMODU 50/50 Grid

Product Type

PCB Header

Pitch

1.27mm

Current

3A

Number of Contacts

20

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Unshrouded

Mount Type

Surface

Connector System

Wire-to-Board

Contact Plating

Tin

Contact Material

Copper Tin, Phosphor Bronze

Row Pitch

1.27mm

Minimum Operating Temperature

-65°C

Termination Type

Solder

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, RoHS, UL E28476

Voltage

250 V

Distrelec Product Id

304-48-529

Non conforme

Pays d'origine :
MX
The TE Connectivity PCB Mount Receptacle is engineered for vertical, board-to-board applications that require a reliable connection. With its 20 positions aligned on a 1.27 mm centreline, this connector delivers a robust solution for signal transmission in compact electronic designs. The black housing not only provides a sleek appearance but also ensures durability and functionality. Designed for surface mounting, it features gold plating that enhances conductivity while offering superior corrosion resistance. The unique design facilitates seamless integration into your printed circuit board, ensuring optimal mechanical stability throughout its operational life.

Constructed from high quality liquid crystal polymer for enhanced thermal stability

Utilises a polarising tab for precise mating alignment and secure connections

Features a hold down post retention mechanism for robust PCB attachment

Optimised for reflow solder processes ensuring compatibility with various assembly techniques

Low halogen content makes it suitable for environmentally conscious applications

The connector assembly is designed to seamlessly integrate with AMPMODU series components

Liens connexes