TE Connectivity AMPMODU 50/50 Grid Series Vertical Surface PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded

Sous-total (1 tube de 36 unités)*

324,90 €

(TVA exclue)

393,13 €

(TVA incluse)

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  • Expédition à partir du 26 janvier 2026
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Tube(s)
le tube
Prix par unité*
1 +324,90 €9,025 €

*Prix donné à titre indicatif

N° de stock RS:
471-902
Référence fabricant:
104693-4
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Series

AMPMODU 50/50 Grid

Product Type

PCB Header

Pitch

1.27mm

Current

0.5A

Housing Material

Thermoplastic

Number of Contacts

40

Number of Rows

2

Orientation

Vertical

Shrouded/Unshrouded

Shrouded

Mount Type

Surface

Connector System

Board-to-Board

Contact Plating

Gold

Contact Material

Phosphor Bronze

Row Pitch

1.27mm

Minimum Operating Temperature

65°C

Termination Type

Surface Mount

Maximum Operating Temperature

105°C

Standards/Approvals

CSA LR7189, UL E28476

Voltage

30 V

Distrelec Product Id

304-53-647

Non conforme

Pays d'origine :
US
The TE Connectivity PCB Mount Header seamlessly integrates into your electronic projects, providing robust connectivity solutions. Featuring a vertical configuration and a fully shrouded design, it accommodates up to 40 positions while ensuring reliability and ease of use. The 1.27 mm centreline spacing enhances compatibility with various PCB designs, catering to both hobbyists and professionals alike. Crafted with high-quality materials, the connector boasts gold plating for optimal conductivity, ensuring that your applications can perform under demanding conditions. With a rated operating voltage of 30 VAC, it is suitable for a multitude of applications, promising durability and longevity. The surface mount design further simplifies installation, making it an essential component for modern electronics.

Vertical orientation optimises space on circuit boards

Fully shrouded feature enhances protection against dust and foreign matter

Designed for board to board connections enhancing versatility

Constructed with copper alloy for improved retention and durability

Mating alignment is keyed for precise connections

Standard profile ensures compatibility with existing design layouts

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