STMicroelectronics 3-Axis Surface Accelerometer, LGA, I2C, MIPI I3CSM, SPI, 14-Pin
- N° de stock RS:
- 265-1029
- Référence fabricant:
- ASM330LHBTR
- Fabricant:
- STMicroelectronics
Prix L'unité (sur une bobine de 5000)
11,468 €
(TVA exclue)
13,876 €
(TVA incluse)
En cours d'approvisionnement - expédition le 10/09/2024, livraison sous 4 jour(s)
Unité | Prix par unité | la bobine* |
|---|---|---|
| 5000 + | 11,468 € | 57 340,00 € |
*prix conseillé
- N° de stock RS:
- 265-1029
- Référence fabricant:
- ASM330LHBTR
- Fabricant:
- STMicroelectronics
Documentation technique
Législations et de normes
- Pays d'origine :
- MT
Détails du produit
High-accuracy automotive 6-axis inertial module for car electronic control units with ASIL-B certification
The ASM330LHB is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope with an extended temperature range up to +105 °C.
A safety manual and a software library, certified according to ISO26262:2018, are provided to support the development of applications using the ASM330LHB and targeting ASIL-B requirements.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHB is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
A safety manual and a software library, certified according to ISO26262:2018, are provided to support the development of applications using the ASM330LHB and targeting ASIL-B requirements.
ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve both the automotive and consumer market. The ASM330LHB is AEC-Q100 compliant and industrialized through a dedicated MEMS production flow to meet automotive reliability standards. All the parts are fully tested with respect to temperature to ensure the highest quality level.
The sensing elements are manufactured using ST’s proprietary micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit, which is trimmed to better match the characteristics of the sensing element.
The ASM330LHB has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of automotive applications.
The device supports dual operating modes: high-performance mode and low-power mode.
All the design aspects of the ASM330LHB have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHB is available in a 14-lead plastic land grid array (LGA) package.
The ASM330LHB has a full-scale acceleration range of ±2/±4/±8/±16 g and a wide angular rate range of ±125/±250/±500/±1000/±2000/±4000 dps that enable its usage in a broad range of automotive applications.
The device supports dual operating modes: high-performance mode and low-power mode.
All the design aspects of the ASM330LHB have been optimized to reach superior output stability, extremely low noise, and full data synchronization to the benefit of sensor-assisted applications like dead reckoning and sensor fusion.
The ASM330LHB is available in a 14-lead plastic land grid array (LGA) package.
Key features
Spécifications
Attribut | Valeur |
|---|---|
| Sensor Type | Accelerometer, Gyroscope |
| Number of Axis | 3 |
| Technology | 3 Axis 12-bit Accelerometer |
| Mounting Type | Surface |
| Interface Type | I2C, MIPI I3CSM, SPI |
| Package Type | LGA |
| Pin Count | 14 |