TDK 4.7 nF Multilayer Ceramic Capacitor, 100V dc, ±10 %, Surface
- N° de stock RS:
- 183-5879
- Référence fabricant:
- CEU4J2X7R2A472K125AE
- Fabricant:
- TDK
Offre groupée disponible
Consulter les options de prix de grosSous-total (100 unités, dans un pack de 100)*
9,50 €
(TVA exclue)
11,50 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
En stock
- 800 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité | le paquet* |
|---|---|---|
| 100 - 400 | 0,095 € | 9,50 € |
| 500 - 900 | 0,079 € | 7,90 € |
| 1000 + | 0,076 € | 7,60 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 183-5879
- Référence fabricant:
- CEU4J2X7R2A472K125AE
- Fabricant:
- TDK
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TDK | |
| Capacitance | 4.7nF | |
| Product Type | Multilayer Ceramic Capacitor | |
| Voltage | 100V dc | |
| Package/Case | 0805 | |
| Mount Type | Surface | |
| Packaging | Embossed Tape | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Series | CEU | |
| Standards/Approvals | No | |
| Length | 2mm | |
| Height | 1.25mm | |
| Width | 1.25mm | |
| Maximum Operating Temperature | 125°C | |
| Sélectionner tout | ||
|---|---|---|
Marque TDK | ||
Capacitance 4.7nF | ||
Product Type Multilayer Ceramic Capacitor | ||
Voltage 100V dc | ||
Package/Case 0805 | ||
Mount Type Surface | ||
Packaging Embossed Tape | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Series CEU | ||
Standards/Approvals No | ||
Length 2mm | ||
Height 1.25mm | ||
Width 1.25mm | ||
Maximum Operating Temperature 125°C | ||
- Pays d'origine :
- JP
To make multilayer ceramic chip capacitors more compact with larger capacity, we drew on TDK's advanced material technologies, making the particle sizes super fine. By putting our original processing technologies to full use, we have used our advanced layering technique which ensures the precise placing of dielectric and electrode layers, as well as the multilayering technology capable of as many as 1000 layers. The thickness of each layer is at a submicron level. By reducing the thickness of each layer and increasing the number of layers, even the ultrasmall chip combines the capacity close to that of tantalum capacitors with excellent reliability.
Fail-safe function with serial configuration of capacitors inside a single product.
Improved stress resistance.
Improved thermal shock resistance.
Allows for reduction of PCB space.
Applications
Power supply without protective circuit
Automotive battery line
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