TDK 470 nF Multilayer Ceramic Capacitor, 250V dc, ±10 %, Surface
- N° de stock RS:
- 183-5856
- Référence fabricant:
- C4532X7R2E474K230KE
- Fabricant:
- TDK
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 183-5856
- Référence fabricant:
- C4532X7R2E474K230KE
- Fabricant:
- TDK
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 470nF | |
| Voltage | 250V dc | |
| Package/Case | 1812 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7R | |
| Tolerance | ±10 % | |
| Automotive Standard | No | |
| Termination Type | Solder | |
| Minimum Operating Temperature | -55°C | |
| Series | C | |
| Width | 3.2mm | |
| Length | 4.5mm | |
| Height | 2.5mm | |
| Standards/Approvals | No | |
| Maximum Operating Temperature | 125°C | |
| Sélectionner tout | ||
|---|---|---|
Marque TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 470nF | ||
Voltage 250V dc | ||
Package/Case 1812 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7R | ||
Tolerance ±10 % | ||
Automotive Standard No | ||
Termination Type Solder | ||
Minimum Operating Temperature -55°C | ||
Series C | ||
Width 3.2mm | ||
Length 4.5mm | ||
Height 2.5mm | ||
Standards/Approvals No | ||
Maximum Operating Temperature 125°C | ||
- Pays d'origine :
- JP
TDK multilayer ceramic chip capacitor Soft termination General grade C series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall.
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