TDK 1nF Multilayer Ceramic Capacitor MLCC, 50V dc V, ±10% , SMD
- N° de stock RS:
- 179-5576
- Référence fabricant:
- CGA3E2X7R1H102K080AE
- Fabricant:
- TDK
Offre groupée disponible
Sous-total (1 bobine de 500 unités)*
23,00 €
(TVA exclue)
28,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
En stock
- 1 500 unité(s) prête(s) à être expédiée(s) d'un autre centre de distribution
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Unité | Prix par unité | la bobine* |
|---|---|---|
| 500 - 1500 | 0,046 € | 23,00 € |
| 2000 + | 0,042 € | 21,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 179-5576
- Référence fabricant:
- CGA3E2X7R1H102K080AE
- Fabricant:
- TDK
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TDK | |
| Capacitance | 1nF | |
| Voltage | 50V dc | |
| Package/Case | 0603 (1608M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 1.6 x 0.8 x 0.8mm | |
| Automotive Standard | AEC-Q200 | |
| Length | 1.6mm | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Series | CGA | |
| Maximum Operating Temperature | +125°C | |
| Minimum Operating Temperature | -55°C | |
| Suppression Class | Class 2 | |
| Sélectionner tout | ||
|---|---|---|
Marque TDK | ||
Capacitance 1nF | ||
Voltage 50V dc | ||
Package/Case 0603 (1608M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 1.6 x 0.8 x 0.8mm | ||
Automotive Standard AEC-Q200 | ||
Length 1.6mm | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Series CGA | ||
Maximum Operating Temperature +125°C | ||
Minimum Operating Temperature -55°C | ||
Suppression Class Class 2 | ||
- Pays d'origine :
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Liens connexes
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