TDK 6 pF Multilayer Ceramic Capacitor, 50V dc, 0.5 pF, Surface
- N° de stock RS:
- 179-5219
- Référence fabricant:
- CGA2B2NP01H060D050BA
- Fabricant:
- TDK
Actuellement indisponible
Nous ne savons pas si cet article sera de nouveau disponible. RS a l'intention de le retirer de son assortiment sous peu.
- N° de stock RS:
- 179-5219
- Référence fabricant:
- CGA2B2NP01H060D050BA
- Fabricant:
- TDK
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 6pF | |
| Voltage | 50V dc | |
| Package/Case | 0402 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | C0G | |
| Tolerance | 0.5 pF | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | CGA | |
| Width | 500μm | |
| Length | 1mm | |
| Standards/Approvals | No | |
| Height | 500μm | |
| Maximum Operating Temperature | 150°C | |
| Suppression Class | Class I | |
| Sélectionner tout | ||
|---|---|---|
Marque TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 6pF | ||
Voltage 50V dc | ||
Package/Case 0402 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric C0G | ||
Tolerance 0.5 pF | ||
Automotive Standard AEC-Q200 | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series CGA | ||
Width 500μm | ||
Length 1mm | ||
Standards/Approvals No | ||
Height 500μm | ||
Maximum Operating Temperature 150°C | ||
Suppression Class Class I | ||
Features
With a maximum temperature of 150°C and a capacitance change within ±15%, the series is suited for devices that operate in high-temperature environments.
Excellent DC bias properties.
Applications
Automotive applications (engine rooms)
Peripheral circuits of IGDT, SiC, GaN used at high temperature environments
Sensor Module
Smoothing and decoupling applications for other devices that operate at high temperature
Liens connexes
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