TDK 10nF Multilayer Ceramic Capacitor MLCC, 630V dc V, ±10% , SMD
- N° de stock RS:
- 179-4987
- Référence fabricant:
- CGA5H4X7R2J103K115AE
- Fabricant:
- TDK
Offre groupée disponible
Sous-total (1 bobine de 2000 unités)*
116,00 €
(TVA exclue)
140,00 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 30 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Unité | Prix par unité | la bobine* |
|---|---|---|
| 2000 - 4000 | 0,058 € | 116,00 € |
| 6000 + | 0,055 € | 110,00 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 179-4987
- Référence fabricant:
- CGA5H4X7R2J103K115AE
- Fabricant:
- TDK
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TDK | |
| Capacitance | 10nF | |
| Voltage | 630V dc | |
| Package/Case | 1206 (3216M) | |
| Mounting Type | Surface Mount | |
| Dielectric | X7R | |
| Tolerance | ±10% | |
| Dimensions | 3.2 x 1.6 x 1.15mm | |
| Length | 3.2mm | |
| Automotive Standard | AEC-Q200 | |
| Depth | 1.6mm | |
| Height | 1.15mm | |
| Series | CGA | |
| Minimum Operating Temperature | -55°C | |
| Suppression Class | Class 2 | |
| Maximum Operating Temperature | +125°C | |
| Sélectionner tout | ||
|---|---|---|
Marque TDK | ||
Capacitance 10nF | ||
Voltage 630V dc | ||
Package/Case 1206 (3216M) | ||
Mounting Type Surface Mount | ||
Dielectric X7R | ||
Tolerance ±10% | ||
Dimensions 3.2 x 1.6 x 1.15mm | ||
Length 3.2mm | ||
Automotive Standard AEC-Q200 | ||
Depth 1.6mm | ||
Height 1.15mm | ||
Series CGA | ||
Minimum Operating Temperature -55°C | ||
Suppression Class Class 2 | ||
Maximum Operating Temperature +125°C | ||
- Pays d'origine :
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
Liens connexes
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