TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Surface Mount DDR3 DIMM Socket ,1.5 V

Sous-total (1 bobine de 150 unités)*

1 132,30 €

(TVA exclue)

1 370,08 €

(TVA incluse)

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  • Expédition à partir du 13 mars 2026
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la bobine
Prix par unité*
1 +1 132,30 €7,549 €

*Prix donné à titre indicatif

N° de stock RS:
478-604
Numéro d'article Distrelec:
304-59-377
Référence fabricant:
2-2013310-3
Fabricant:
TE Connectivity
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Marque

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Contact Plating

Gold

Number of Contacts

204

Pitch

0.6mm

Mount Type

Surface

Housing Material

High Temperature Thermoplastic

SDRAM Type

DDR3

Termination Type

Surface Mount

Latching

Yes

Maximum Operating Temperature

260°C

Row Spacing

8.2mm

Standards/Approvals

UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32

Voltage

1.5 V

Pays d'origine :
CN
The TE Connectivity Emboss tape memory socket is engineered for excellence in performance and reliability. Designed specifically for high-speed memory applications, this socket accommodates 204 positions while ensuring a right-angle module orientation, which facilitates a compact assembly. With a stack height of 9.2 mm, it seamlessly fits into space-constrained environments. The robust construction features durable materials, including high-temperature thermoplastic housing and stainless steel latch components, ensuring long-lasting functionality under diverse conditions. Additionally, this model adheres to key industry standards, boasting compliance with EU RoHS and REACH regulations, ensuring that it meets the rigorous demands of today’s electronic market. By integrating this socket into your technology, you gain a dependable partner that supports optimal data processing capabilities.

High-performance memory support for DDR3 standards

Right-angle module orientation enhances installation flexibility

Stainless steel latch offers secure retention for memory modules

High-temperature thermoplastic housing withstands extreme conditions

Gold-plated contacts ensure superior electrical conductivity

Designed for seamless PCB surface mounting integration

Low halogen materials contribute to environmentally conscious manufacturing

Each unit is packaged to ensure efficient handling and volume management

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