TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Surface Mount DDR3 DIMM Socket ,1.5 V
- N° de stock RS:
- 478-604
- Numéro d'article Distrelec:
- 304-59-377
- Référence fabricant:
- 2-2013310-3
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 150 unités)*
1 132,30 €
(TVA exclue)
1 370,08 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 13 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 132,30 € | 7,549 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 478-604
- Numéro d'article Distrelec:
- 304-59-377
- Référence fabricant:
- 2-2013310-3
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Insertion/Removal Method | Cam-In | |
| Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mount Type | Surface | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Termination Type | Surface Mount | |
| Latching | Yes | |
| Maximum Operating Temperature | 260°C | |
| Row Spacing | 8.2mm | |
| Standards/Approvals | UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32 | |
| Voltage | 1.5 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Insertion/Removal Method Cam-In | ||
Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mount Type Surface | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Termination Type Surface Mount | ||
Latching Yes | ||
Maximum Operating Temperature 260°C | ||
Row Spacing 8.2mm | ||
Standards/Approvals UL 94V-0, 2016, EU RoHS Directive 2011/65/EU Compliant, EU ELV Directive 2000/53/EC Compliant, China RoHS 2 Directive MIIT Order No 32 | ||
Voltage 1.5 V | ||
- Pays d'origine :
- CN
The TE Connectivity Emboss tape memory socket is engineered for excellence in performance and reliability. Designed specifically for high-speed memory applications, this socket accommodates 204 positions while ensuring a right-angle module orientation, which facilitates a compact assembly. With a stack height of 9.2 mm, it seamlessly fits into space-constrained environments. The robust construction features durable materials, including high-temperature thermoplastic housing and stainless steel latch components, ensuring long-lasting functionality under diverse conditions. Additionally, this model adheres to key industry standards, boasting compliance with EU RoHS and REACH regulations, ensuring that it meets the rigorous demands of todays electronic market. By integrating this socket into your technology, you gain a dependable partner that supports optimal data processing capabilities.
High-performance memory support for DDR3 standards
Right-angle module orientation enhances installation flexibility
Stainless steel latch offers secure retention for memory modules
High-temperature thermoplastic housing withstands extreme conditions
Gold-plated contacts ensure superior electrical conductivity
Designed for seamless PCB surface mounting integration
Low halogen materials contribute to environmentally conscious manufacturing
Each unit is packaged to ensure efficient handling and volume management
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