TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Surface Mount DDR3 DIMM Socket ,1.5 V

Voir l’ensemble des Memory Sockets

Sous-total (1 plateau de 100 unités)*

176,74 €

(TVA exclue)

213,86 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 13 mars 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x)
le plateau
Prix par unité*
1 +176,74 €1,767 €

*Prix donné à titre indicatif

N° de stock RS:
467-536
Numéro d'article Distrelec:
304-59-435
Référence fabricant:
2013311-1
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Memory Socket Type

DIMM

Product Type

DIMM Socket

Insertion/Removal Method

Cam-In

Orientation

Right Angle

Contact Material

Copper Alloy

Contact Plating

Gold Flash

Number of Contacts

204

Pitch

0.6mm

Mount Type

Surface

Housing Material

High Temperature Thermoplastic

SDRAM Type

DDR3

Latching

Yes

Termination Type

Surface Mount

Row Spacing

8.2mm

Standards/Approvals

UL 94 V-0

Voltage

1.5 V

Series

RAYCHEM RVS

Pays d'origine :
CN
The TE Connectivity Semi-hard tray for sockets offers a robust solution for memory integration, ensuring secure assembly and optimal performance. Designed with precision, this innovative component features a right-angle orientation and an impressive stack height of 9.2 mm, making it ideal for space-constrained applications. Its dual-bay configuration and the integrated locking ejector mechanism contribute to seamless installation and operation in various electronic systems. Noteworthy for its compatibility, the product not only supports advanced memory applications but also adheres to essential industry standards, ensuring reliability and longevity. With a focus on high-quality materials and engineering, this component is built to withstand demanding environments while maintaining excellent functionality.

Perfectly designed for double data rate (DDR) memory applications

Offers high-temperature thermoplastic housing to resist thermal stress

Features robust tin-plated latches for enhanced durability

Ensures compatibility with various printed circuit boards for versatile use

Meets stringent UL flammability ratings for safety assurance

Low halogen content demonstrates commitment to environmental standards

Reflow solder capable to 245°C for flexible assembly processes

Packaging quantity of 20 allows for efficient inventory management

Liens connexes