TE Connectivity 0.6mm Pitch 204 Way, Right Angle SMT Mount DDR3 DIMM Socket ,1.5 V
- N° de stock RS:
- 467-536
- Référence fabricant:
- 2013311-1
- Fabricant:
- TE Connectivity
Sous-total (1 plateau de 100 unités)*
176,74 €
(TVA exclue)
213,86 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 19 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Plateau(x) | le plateau | Prix par unité* |
|---|---|---|
| 1 + | 176,74 € | 1,767 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 467-536
- Référence fabricant:
- 2013311-1
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mounting Type | Surface Mount | |
| SDRAM Type | DDR3 | |
| Voltage Rating | 1.5 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mounting Type Surface Mount | ||
SDRAM Type DDR3 | ||
Voltage Rating 1.5 V | ||
- Pays d'origine :
- CN
The TE Connectivity Semi-hard tray for sockets offers a robust solution for memory integration, ensuring secure assembly and optimal performance. Designed with precision, this innovative component features a right-angle orientation and an impressive stack height of 9.2 mm, making it ideal for space-constrained applications. Its dual-bay configuration and the integrated locking ejector mechanism contribute to seamless installation and operation in various electronic systems. Noteworthy for its compatibility, the product not only supports advanced memory applications but also adheres to essential industry standards, ensuring reliability and longevity. With a focus on high-quality materials and engineering, this component is built to withstand demanding environments while maintaining excellent functionality.
Perfectly designed for double data rate (DDR) memory applications
Offers high-temperature thermoplastic housing to resist thermal stress
Features robust tin-plated latches for enhanced durability
Ensures compatibility with various printed circuit boards for versatile use
Meets stringent UL flammability ratings for safety assurance
Low halogen content demonstrates commitment to environmental standards
Reflow solder capable to 245°C for flexible assembly processes
Packaging quantity of 20 allows for efficient inventory management
Offers high-temperature thermoplastic housing to resist thermal stress
Features robust tin-plated latches for enhanced durability
Ensures compatibility with various printed circuit boards for versatile use
Meets stringent UL flammability ratings for safety assurance
Low halogen content demonstrates commitment to environmental standards
Reflow solder capable to 245°C for flexible assembly processes
Packaging quantity of 20 allows for efficient inventory management
Liens connexes
- TE Connectivity 0.6mm Pitch 204 Way1.5 V
- TE Connectivity 0.6mm Pitch 204 Way1.5 V
- TE Connectivity 0.6mm Pitch 204 Way1.5 V
- TE Connectivity 0.6mm Pitch 204 Way1.5 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
- TE Connectivity 0.6mm Pitch 200 Way1.8 V
- TE Connectivity 0.6mm Pitch 200 Way1.8 V
- TE Connectivity 0.6mm Pitch 200 Way1.8 V ,500mA
