Name: TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Board Mount DDR3 DIMM Socket ,1.5 V, 500mA
Brand: TE Connectivity
SKU: 474-377
Price: 1355.10 EUR
Availability: BackOrder

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Sélectionner tout	Attribut	Valeur
	Marque	TE Connectivity
	Memory Socket Type	DIMM
	Product Type	DIMM Socket
	Insertion/Removal Method	Cam-In
	Orientation	Right Angle
	Current	500mA
	Contact Material	Copper Alloy
	Contact Plating	Gold
	Number of Contacts	204
	Pitch	0.6mm
	Mount Type	Board
	Housing Material	High Temperature Thermoplastic
	SDRAM Type	DDR3
	Minimum Operating Temperature	-55°C
	Latching	Yes
	Termination Type	Surface Mount
	Maximum Operating Temperature	85°C
	Row Spacing	8.2mm
	Standards/Approvals	EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU ELV Directive 2000/53/EC
	Voltage	1.5 V
	Series	RAYCHEM RVS

	Sélectionner tout
	Marque TE Connectivity
	Memory Socket Type DIMM
	Product Type DIMM Socket
	Insertion/Removal Method Cam-In
	Orientation Right Angle
	Current 500mA
	Contact Material Copper Alloy
	Contact Plating Gold
	Number of Contacts 204
	Pitch 0.6mm
	Mount Type Board
	Housing Material High Temperature Thermoplastic
	SDRAM Type DDR3
	Minimum Operating Temperature -55°C
	Latching Yes
	Termination Type Surface Mount
	Maximum Operating Temperature 85°C
	Row Spacing 8.2mm
	Standards/Approvals EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU ELV Directive 2000/53/EC
	Voltage 1.5 V
	Series RAYCHEM RVS

The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.

Designed for high-density memory applications

Optimised for space-constrained layouts

Constructed for exceptional durability and longevity

Gold plating enhances electrical conductivity

Supports operational stability across a wide temperature range

Offers reverse keying to prevent incorrect insertion

Surface mount termination simplifies integration into PCB designs

Suitable for high-performance computing requirements

TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Board Mount DDR3 DIMM Socket ,1.5 V, 500mA

Frais de livraison offerts pour toute commande de plus de 75,00 €

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