TE Connectivity 0.6 mm Pitch 204 Way, Right Angle Board Mount DDR3 DIMM Socket ,1.5V, 500mA
- N° de stock RS:
- 474-377
- Numéro d'article Distrelec:
- 304-63-290
- Référence fabricant:
- 2-2013290-2
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 200 unités)*
1 119,92 €
(TVA exclue)
1 355,10 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Stocké-e par le fabricant
- Prêt à être expédié à partir du 02 juillet 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 119,92 € | 5,60 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 474-377
- Numéro d'article Distrelec:
- 304-63-290
- Référence fabricant:
- 2-2013290-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM | |
| Product Type | DIMM Socket | |
| Orientation | Right Angle | |
| Insertion/Removal Method | Cam-In | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mount Type | Board | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR3 | |
| Minimum Operating Temperature | -55°C | |
| Latching | Yes | |
| Termination Type | Surface Mount | |
| Row Spacing | 8.2mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU ELV Directive 2000/53/EC | |
| Series | RAYCHEM RVS | |
| Voltage | 1.5V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM | ||
Product Type DIMM Socket | ||
Orientation Right Angle | ||
Insertion/Removal Method Cam-In | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mount Type Board | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR3 | ||
Minimum Operating Temperature -55°C | ||
Latching Yes | ||
Termination Type Surface Mount | ||
Row Spacing 8.2mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals EU RoHS Directive 2011/65/EU, China RoHS 2 Directive MIIT Order No 32, UL 94V-0, 2016, EU ELV Directive 2000/53/EC | ||
Series RAYCHEM RVS | ||
Voltage 1.5V | ||
- Pays d'origine :
- CN
The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.
Designed for high-density memory applications
Optimised for space-constrained layouts
Constructed for exceptional durability and longevity
Gold plating enhances electrical conductivity
Supports operational stability across a wide temperature range
Offers reverse keying to prevent incorrect insertion
Surface mount termination simplifies integration into PCB designs
Suitable for high-performance computing requirements
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