TE Connectivity 0.6mm Pitch 204 Way, Right Angle Board Mount Mount DDR3 DIMM Socket ,1.5 V ,500mA
- N° de stock RS:
- 474-377
- Référence fabricant:
- 2-2013290-2
- Fabricant:
- TE Connectivity
Sous-total (1 bobine de 200 unités)*
1 119,92 €
(TVA exclue)
1 355,10 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- Expédition à partir du 15 janvier 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Bobine(s) | la bobine | Prix par unité* |
|---|---|---|
| 1 + | 1 119,92 € | 5,60 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 474-377
- Référence fabricant:
- 2-2013290-2
- Fabricant:
- TE Connectivity
Spécifications
Documentation technique
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Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | TE Connectivity | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 204 | |
| Pitch | 0.6mm | |
| Mounting Type | Board Mount | |
| SDRAM Type | DDR3 | |
| Current Rating | 500mA | |
| Voltage Rating | 1.5 V | |
| Sélectionner tout | ||
|---|---|---|
Marque TE Connectivity | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 204 | ||
Pitch 0.6mm | ||
Mounting Type Board Mount | ||
SDRAM Type DDR3 | ||
Current Rating 500mA | ||
Voltage Rating 1.5 V | ||
- Pays d'origine :
- CN
The TE Connectivity Double data rate (DDR) 3 SO DIMM socket offers a sophisticated solution for memory card connectivity, tailored for modern electronic designs. Featuring a stack height of 5.2 mm and a right-angle module orientation, this connector is designed to fit seamlessly into compact spaces, ensuring efficient performance without compromising on accessibility. With 204 positions, it supports high-density memory modules, making it ideal for applications that demand reliable speed and efficacy. Crafted from high-temperature thermoplastic, its durable housing ensures longevity, while gold plating on contact areas enhances conductivity. This socket is engineered to meet rigorous electrical standards, ensuring it can withstand demanding operational environments.
Designed for high-density memory applications
Optimised for space-constrained layouts
Constructed for exceptional durability and longevity
Gold plating enhances electrical conductivity
Supports operational stability across a wide temperature range
Offers reverse keying to prevent incorrect insertion
Surface mount termination simplifies integration into PCB designs
Suitable for high-performance computing requirements
Optimised for space-constrained layouts
Constructed for exceptional durability and longevity
Gold plating enhances electrical conductivity
Supports operational stability across a wide temperature range
Offers reverse keying to prevent incorrect insertion
Surface mount termination simplifies integration into PCB designs
Suitable for high-performance computing requirements
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