OIS-150-1450p-X-T EPIGAP OSA Photonics, OIS-150 1450nm IR LED, 1206 SMD package
- RS Stock No.:
- 173-6369
- Mfr. Part No.:
- OIS-150-1450p-X-T
- Brand:
- EPIGAP OSA Photonics
Bulk discount available
Subtotal (1 unit)*
8,65 €
(exc. VAT)
10,47 €
(inc. VAT)
Frais de livraison offerts pour toute commande de plus de 75,00 €
Temporairement en rupture de stock
- 1 unité(s) expédiée(s) à partir du 22 décembre 2025
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Units | Per unit |
|---|---|
| 1 - 4 | 8,65 € |
| 5 - 9 | 8,39 € |
| 10 - 24 | 8,14 € |
| 25 - 49 | 7,90 € |
| 50 + | 7,66 € |
*price indicative
- RS Stock No.:
- 173-6369
- Mfr. Part No.:
- OIS-150-1450p-X-T
- Brand:
- EPIGAP OSA Photonics
Specifications
Technical Reference
Legislation and Compliance
Product Details
Find similar products by selecting one or more attributes.
Select all | Attribute | Value |
|---|---|---|
| Marque | EPIGAP OSA Photonics | |
| Peak Wavelength | 1450nm | |
| Package Type | 1206 | |
| Mounting Type | Surface Mount | |
| Number of LEDs | 1 | |
| Number of Pins | 2 | |
| Dimensions | 3.2 x 1.6 x 1.2mm | |
| Lens Shape | Square | |
| Series | OIS-150 | |
| LED Material | AlInGaP, GaAlAs, GaP, InGaN | |
| Select all | ||
|---|---|---|
Marque EPIGAP OSA Photonics | ||
Peak Wavelength 1450nm | ||
Package Type 1206 | ||
Mounting Type Surface Mount | ||
Number of LEDs 1 | ||
Number of Pins 2 | ||
Dimensions 3.2 x 1.6 x 1.2mm | ||
Lens Shape Square | ||
Series OIS-150 | ||
LED Material AlInGaP, GaAlAs, GaP, InGaN | ||
We develop and manufacture special, custom designed and standard High Brightness & High Power LED-Chips , SMD-LEDs and LED-Lamps in the colors white, uv 265-420nm ,vis 420-660nm and ir 660-1650nm. Our custom designed LED-Modules for OEMs are an efficient way for luminaries and other lighting applications.
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
size: 3.2mm x 1.6mm x 1.2mm
view angle: 140°
technology: GaP, AlInGaP, GaAlAs and InGaN
(un)colored, (un)diffused encapsulation available
soldering pads: gold plated
suitable for all SMT assembly methods
View angle 40°
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
package: 1206
size: 3.2mm x 1.6mm x 1.2mm
circuit substrate: glass laminated epoxy
Lead free solderable, soldering pads:gold plated
taped in 8 mm blister tape, cathode to transporting perforation
all devices sorted into luminous intensity classes
taping: face-up(TU) or face-down(TD) possible
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