Infineon IKZ75N65EH5XKSA1, Type N-Channel IGBT, 90 A 650 V, 4-Pin TO-247, Through Hole

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7,87 €

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9,52 €

(TVA incluse)

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*Prix donné à titre indicatif

N° de stock RS:
273-2988
Référence fabricant:
IKZ75N65EH5XKSA1
Fabricant:
Infineon
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Marque

Infineon

Product Type

IGBT

Maximum Continuous Collector Current Ic

90A

Maximum Collector Emitter Voltage Vceo

650V

Maximum Power Dissipation Pd

395W

Package Type

TO-247

Mount Type

Through Hole

Channel Type

Type N

Pin Count

4

Minimum Operating Temperature

-40°C

Maximum Collector Emitter Saturation Voltage VceSAT

1.65V

Maximum Operating Temperature

175°C

Series

IKZ

Height

5.21mm

Length

21.1mm

Width

16.13mm

Standards/Approvals

JEDEC, RoHS

Automotive Standard

No

Infineon IKZ Series IGBT, 90A Maximum Continuous Collector Current, 650V Maximum Gate-Emitter Voltage - IKZ75N65EH5XKSA1


This IGBT is a high-voltage switching semiconductor intended for power conversion and control tasks. It operates across a broad thermal range and is supplied in a through-hole TO-247 package suited to systems requiring robust mounting and straightforward thermal interfacing. The device meets common industry approvals and is designed for applications demanding substantial continuous current handling and elevated gate-emitter voltage capability.

Features and Benefits:


• 90A continuous collector current delivers sustained high-current switching capacity
• 650V gate-emitter rating enables high-voltage switching applications
• 1.65V maximum VceSAT reduces conduction losses in driven loads
• 395W power dissipation supports heavy-duty thermal loading
• -40°C to 175°C operating range permits wide-temperature deployment

Applications


• Suitable for motor drive inverter stages
• Ideal for industrial power converters and UPS systems
• Used with high-voltage DC link switching topologies
• Can be used for traction and heavy-vehicle power modules
• Useful in laboratory power electronics test rigs

What mounting method is required for secure installation?


The component is provided in a through-hole TO-247 package for secure board fastening and direct heatsink attachment.

Which approvals indicate compatibility with industry manufacturing standards?


It is approved to JEDEC criteria and conforms to RoHS substance restrictions.

How does the device cope with thermal stress during operation?


The maximum power dissipation rating of 395W defines its thermal load handling when mounted with appropriate cooling measures.

What pin count must be considered when designing the PCB footprint?


The device utilises a four-pin arrangement that should be accommodated in the PCB layout.

Is this component designed to automotive specification levels?


It is not classified to automotive standards and should not be assumed compliant for automotive-qualified systems.

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