TE Connectivity 2.54mm Pitch 10 Way Through Hole IC Socket

Sous-total (1 tube de 150 unités)*

267,60 €

(TVA exclue)

323,80 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 04 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Tube(s)
le tube
Prix par unité*
1 +267,60 €1,784 €

*Prix donné à titre indicatif

N° de stock RS:
471-510
Référence fabricant:
1-1571995-0
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Gender

Socket

Number of Contacts

10

Number of Rows

1

Pitch

2.54mm

Socket Mounting Type

Through Hole

Pays d'origine :
US
The TE Connectivity SIP socket assembly is designed for optimal performance in a range of applications. It features a robust construction tailored to ensure reliable connections on printed circuit boards. The innovative design facilitates easy integration, making it an ideal component for both new designs and replacement needs. With a focus on precision and dependability, this assembly enhances circuit performance while meeting stringent industry standards. Its compact profile and thoughtfully engineered features provide a reliable solution for various signaling applications.

Utilizes thermoplastic housing for enhanced durability and resistance to environmental factors
Incorporates tin-plated contacts to ensure superior conductivity and lower resistance
Features a board mount connector that simplifies installation and improves assembly efficiency
Designed with a profile height that optimizes space utilization on PCB layouts
Contains a reliable current rating of up to 3A, accommodating diverse operational demands
Includes a black sleeve plating that contributes to a professional appearance while protecting against corrosion
Incorporates compliance with EU RoHS and ELV directives, ensuring environmentally safe use
Supports wave soldering processes capable of handling elevated temperatures, facilitating efficient assembly

Liens connexes