TE Connectivity Through Hole Bag, Loose Piece IC Socket

Sous-total (1 sachet de 250 unités)*

253,04 €

(TVA exclue)

306,18 €

(TVA incluse)

Add to Basket
sélectionner ou taper la quantité
Temporairement en rupture de stock
  • Expédition à partir du 27 février 2026
Besoin de plus? Cliquez sur " Vérifier les dates de livraison " pour plus de détails
Sachet(s)
Le Sachet
Prix par unité*
1 +253,04 €1,012 €

*Prix donné à titre indicatif

N° de stock RS:
467-724
Référence fabricant:
1-5050871-0
Fabricant:
TE Connectivity
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout

Marque

TE Connectivity

Package Type

Bag, Loose Piece

Socket Mounting Type

Through Hole

Pays d'origine :
US
The TE Connectivity miniature spring socket connector is designed specifically for seamless cable-to-board applications, offering a reliable and efficient connection for various electronic devices. With its open-bottom sleeve style, this socket ensures easy access for discrete wire attachments, making it an ideal choice in a variety of circuit designs. The robust construction features beryllium copper and gold plating, providing excellent conductivity and durability across operational ranges. Operating effectively in temperatures from -65 to 125 °C, this connector is engineered for resilience and long-term performance, perfect for power and signal circuitry. Whether you are building complex electronic assemblies or need reliable components for prototyping, this socket exceeds expectations with its flexible design and compliance with industry standards.

Supports both through-hole press-fit and solder termination methods
Allows for easy insertion with a hand or semi-automatic method
Compatible with a broad range of wire sizes for versatile connectivity
Constructed to handle high current ratings up to 7.5 A with confidence
Designed for low halogen content, addressing environmental compliance needs
Features a lightweight design that doesn’t compromise on strength or efficiency
Remarkably packaged for high-volume applications with a quantity of 2000 per bag
Enhanced with pin-in-paste capability to facilitate advanced solder processes

Liens connexes