Infineon IR21531STRPBF MOSFET Gate Driver, 260 mA 8-Pin 15.6V, SOIC

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Sous-total (1 paquet de 5 unités)*

8,56 €

(TVA exclue)

10,36 €

(TVA incluse)

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Unité
Prix par unité
le paquet*
5 - 201,712 €8,56 €
25 - 451,488 €7,44 €
50 - 1201,388 €6,94 €
125 - 2451,286 €6,43 €
250 +1,20 €6,00 €

*Prix donné à titre indicatif

Options de conditionnement :
N° de stock RS:
226-6157
Numéro d'article Distrelec:
304-39-410
Référence fabricant:
IR21531STRPBF
Fabricant:
Infineon
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Marque

Infineon

Product Type

MOSFET

Output Current

260mA

Pin Count

8

Package Type

SOIC

Fall Time

80ns

Driver Type

MOSFET

Number of Outputs

2

Rise Time

80ns

Minimum Supply Voltage

10V

Maximum Supply Voltage

15.6V

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Series

IR21531(D)(S) & (PbF)

Width

3.99mm

Standards/Approvals

No

Length

4.98mm

Height

1.75mm

Mount Type

Surface

Automotive Standard

No

Infineon IR21531(D)(S) & (PbF) Series MOSFET, 0.26A Output Current, 10V Minimum Supply Voltage - IR21531STRPBF


This MOSFET is a dual-output driver designed to control power transistors within low-voltage systems, operating from a modest supply and intended for surface-mount implementation on Compact boards. It provides two output channels and is suitable for applications requiring controlled switching behaviour across a defined operating temperature range.

Features and Benefits:


• Operates from a 10V minimum supply for low-voltage designs
• Supports up to 15.6V supply to accommodate higher rails
• Dual outputs provide two independent drive channels
• Output current capability of 0.26A for modest gate-drive needs
• Rise and fall times of 80ns enable predictable switching transitions
• Rated to 125°C maximum operating temperature for high-temperature environments

Applications


• Suitable for driving MOSFET Gates in low-voltage converters
• Ideal for two-channel motor-control driver stages
• Used with half-bridge arrangements requiring matched timing
• Can be used for power management in Compact surface assemblies
• Suited for thermally stressed circuits up to 125°C ambient

What package should I expect for board layout considerations?


It comes in an SOIC-8 package suitable for standard surface-mount assembly.

What pin-count affects PCB footprint design?


The device uses eight pins which determine a typical SOIC-8 land pattern.

What mounting method is required for assembly?


It is intended for surface-mount placement on PCBs.

What temperature extremes can be tolerated during operation?


It is specified to operate down to -40°C and up to 125°C.

How narrow is the device for tight-space applications?


The part has a width of 3.99 mm making it compatible with Compact layouts.

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