Microchip TC4427EUA713 Low Side Gate Driver 1, 1.5 A 8-Pin 18 V, 8-Pin MSOP/PDIP/SOIC

Sous-total (1 bobine de 2500 unités)*

2 980,00 €

(TVA exclue)

3 605,00 €

(TVA incluse)

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  • Expédition à partir du 22 janvier 2026
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Unité
Prix par unité
la bobine*
2500 +1,192 €2 980,00 €

*Prix donné à titre indicatif

N° de stock RS:
598-023
Référence fabricant:
TC4427EUA713
Fabricant:
Microchip
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Marque

Microchip

Product Type

Gate Driver

Output Current

1.5A

Pin Count

8

Fall Time

25ns

Package Type

8-Pin MSOP/PDIP/SOIC

Driver Type

Low Side

Rise Time

25ns

Minimum Supply Voltage

4.5V

Maximum Supply Voltage

18V

Number of Drivers

1

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

85°C

Series

TC442

Width

4.90 mm

Standards/Approvals

No

Height

1.1mm

Automotive Standard

No

Pays d'origine :
TH
The Microchip High-performance dual buffer and driver are designed to provide the optimum solution for your digital circuitry needs. The component serves as an essential link in adapting signal levels, ensuring data transmission integrity throughout complex systems. Featuring superior input/output voltage compatibility, this device enhances signal clarity and reduces distortion, making it ideal for a wide range of applications including microcontroller interfacing and other digital logic. With robust performance in varied environments, this product exemplifies reliability, paving the path for enhanced functionality in your designs. The versatile nature of this driver effectively caters to both high-speed and low-current applications, ensuring that your projects run smoothly while optimising power usage. Its compact size and thorough integration make it a convenient choice for engineers and developers alike, seeking both performance and practicality.

Offers low propagation delay for rapid signal processing

Inputs are fully compatible with TTL and CMOS logic levels

Provides high output drive capability reducing system stress

Designed to operate under a wide voltage range enhancing adaptability

Features an integrated shut-down function for energy efficiency

Compact packaging allows for space-efficient assembly in various projects

Easy integration into existing designs streamlining the development process

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