Altera FPGA Cyclone III 15408 Cells, 15408 Blocks, 484-Pin FBGA
- N° de stock RS:
- 169-5744
- Référence fabricant:
- EP3C16F484C8N
- Fabricant:
- Altera
Pénurie d'approvisionnement
En raison d'une pénurie d'approvisionnement mondial, nous ne savons pas quand ce produit sera à nouveau en stock.
- N° de stock RS:
- 169-5744
- Référence fabricant:
- EP3C16F484C8N
- Fabricant:
- Altera
Spécifications
Documentation technique
Législations et de normes
Détails du produit
Recherchez des produits similaires en sélectionnant un ou plusieurs attributs.
Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Altera | |
| Product Type | FPGA | |
| Series | Cyclone III | |
| Number of Logic Cells | 15408 | |
| Number of Logic Units | 15408 | |
| Number of Multipliers | 56 (18 x 18) | |
| Mount Type | Surface | |
| Minimum Supply Voltage | 1.15V | |
| Package Type | FBGA | |
| Maximum Supply Voltage | 1.25V | |
| Pin Count | 484 | |
| Number of I/Os | 346 | |
| Minimum Operating Temperature | 0°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | No | |
| Height | 2.2mm | |
| Length | 23mm | |
| Width | 23 mm | |
| Automotive Standard | No | |
| Sélectionner tout | ||
|---|---|---|
Marque Altera | ||
Product Type FPGA | ||
Series Cyclone III | ||
Number of Logic Cells 15408 | ||
Number of Logic Units 15408 | ||
Number of Multipliers 56 (18 x 18) | ||
Mount Type Surface | ||
Minimum Supply Voltage 1.15V | ||
Package Type FBGA | ||
Maximum Supply Voltage 1.25V | ||
Pin Count 484 | ||
Number of I/Os 346 | ||
Minimum Operating Temperature 0°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals No | ||
Height 2.2mm | ||
Length 23mm | ||
Width 23 mm | ||
Automotive Standard No | ||
Cyclone FPGA, Altera
An FPGA is a semiconductor device consisting of a Matrix of Configurable Logic Blocks (CLBs) connected through programmable interconnects. The user determines these interconnections by programming SRAM. A CLB can be simple (AND, OR gates, etc) or complex (a Block of RAM). The FPGA allows changes to be MADE to a design even after the device is soldered into a PCB.
Liens connexes
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