Molex, 502790-6091 0.5 mm Pitch 60 Way Right Angle FPC Connector

Sous-total (1 bobine de 2000 unités)*

3 336,64 €

(TVA exclue)

4 037,33 €

(TVA incluse)

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  • Prêt à être expédié à partir du 26 mai 2026
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Bobine(s)
la bobine
Prix par unité*
1 +3 336,64 €1,668 €

*Prix donné à titre indicatif

N° de stock RS:
480-884
Numéro d'article Distrelec:
304-56-472
Référence fabricant:
502790-6091
Fabricant:
Molex
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Marque

Molex

Number of Contacts

60

Product Type

FPC Connector

Contact Material

Phosphor Bronze

Current

0.5A

Pitch

0.5mm

Mount Type

Surface Mount

Contact Position

Bottom

Orientation

Right Angle

Voltage

50Vrms

Minimum Operating Temperature

-40°C

Series

502790-6091

Maximum Operating Temperature

105°C

Number of Rows

1

Standards/Approvals

CHINA RoHS, EU RoHS

Contact Plating

Gold

Pays d'origine :
VN
The TE Connectivity FFC-FPC connector is designed for seamless integration in a variety of electronic applications. Boasting a 0.50mm pitch, this surface mount connector ensures a secure and reliable connection while maintaining a compact form factor. The front flip design allows for straightforward mating operations, making it ideal for high-density configurations. This connector not only accepts FFC/FPC with ear-tabs but also features a double bottom contact design for enhanced performance. With operational temperatures spanning from -40° to +105°C, it is engineered to withstand demanding environments, catering to a broad range of requirements in electronic device design.

Utilises an easy-on front flip mechanism for user-friendly operation

Designed with a space-efficient, surface mount configuration

Features a robust 60-circuit capacity for versatile applications

Constructed with high-quality phosphor bronze for enhanced durability

Gold plating on mating and termination ensures excellent conductivity

Polarized design guarantees correct orientation during installation

Halogen-free materials contribute to environmental compliance

Supports a temperature range suitable for various operating conditions

Net weight precision optimises the overall integration into devices

Embossed tape packaging simplifies automated assembly processes

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