Infineon NOR 256Mbit SPI Flash Memory 24-Pin BGA, S25FL256SAGBHV200

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Sous-total (1 paquet de 2 unités)*

12,38 €

(TVA exclue)

14,98 €

(TVA incluse)

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Prix par unité
le paquet*
2 - 86,19 €12,38 €
10 - 185,795 €11,59 €
20 - 985,64 €11,28 €
100 - 1985,51 €11,02 €
200 +5,38 €10,76 €

*Prix donné à titre indicatif

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N° de stock RS:
193-8746
Référence fabricant:
S25FL256SAGBHV200
Fabricant:
Infineon
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Marque

Infineon

Memory Size

256Mbit

Interface Type

SPI

Package Type

BGA

Pin Count

24

Organisation

32M x 8 bit

Mounting Type

Surface Mount

Cell Type

NOR

Minimum Operating Supply Voltage

2.7 V

Maximum Operating Supply Voltage

3.6 V

Block Organisation

Symmetrical

Length

8mm

Height

1mm

Width

6mm

Dimensions

8 x 6 x 1mm

Automotive Standard

AEC-Q100

Series

S25FL

Number of Bits per Word

8bit

Maximum Random Access Time

14.5ns

Minimum Operating Temperature

-40 °C

Maximum Operating Temperature

+105 °C

Number of Words

32M

This family of devices connect to a host system via a SPI. Traditional SPI single bit serial input and output (Single I/O or SIO) is supported as well as optional two bit (Dual I/O or DIO) and four bit (Quad I/O or QIO) serial commands. This multiple width interface is called SPI Multi-I/O or MIO. In addition, the FL-S family adds support for DDR read commands for SIO, DIO and QIO that transfer address and read data on both edges of the clock.The Eclipse architecture features a Page Programming Buffer that allows up to 128 words (256 bytes) or 256 words (512 bytes) to be programmed in one operation, resulting in faster effective programming and erase than prior generation SPI program or erase algorithms. Executing code directly from flash memory is often called Execute-In-Place or XIP. By using FL-S devices at the higher clock rates supported, with QIO or DDR-QIO commands, the instruction read transfer rate can match or exceed traditional parallel interface, asynchronous, NOR flash memories while reducing signal count dramatically.The S25FL128S and S25FL256S products offer high densities coupled with the flexibility and fast performance required by a variety of embedded applications. They are ideal for code shadowing, XIP and data storage.

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