Infineon NOR 256 MB SPI FL-S Flash 24-Pin BGA, S25FL256SAGBHI200
- N° de stock RS:
- 273-7498
- Référence fabricant:
- S25FL256SAGBHI200
- Fabricant:
- Infineon
Offre groupée disponible
Consulter les options de prix de grosSous-total (1 plateau de 338 unités)*
1 121,82 €
(TVA exclue)
1 357,41 €
(TVA incluse)
Frais de livraison offerts pour toute commande de plus de 90,00 €
Temporairement en rupture de stock
- Expédition à partir du 08 avril 2027
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Unité | Prix par unité | le plateau* |
|---|---|---|
| 338 - 338 | 3,319 € | 1 121,82 € |
| 676 + | 3,236 € | 1 093,77 € |
*Prix donné à titre indicatif
- N° de stock RS:
- 273-7498
- Référence fabricant:
- S25FL256SAGBHI200
- Fabricant:
- Infineon
Spécifications
Documentation technique
Législations et de normes
Détails du produit
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Sélectionner tout | Attribut | Valeur |
|---|---|---|
| Marque | Infineon | |
| Product Type | FL-S Flash | |
| Memory Size | 256MB | |
| Interface Type | SPI | |
| Package Type | BGA | |
| Pin Count | 24 | |
| Maximum Clock Frequency | 133MHz | |
| Cell Type | NOR | |
| Maximum Supply Voltage | 3.6V | |
| Minimum Supply Voltage | 2.7V | |
| Timing Type | DDR | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | +85°C | |
| Standards/Approvals | RoHS | |
| Supply Current | 16mA | |
| Series | S25FL | |
| Automotive Standard | AEC-Q100 | |
| Sélectionner tout | ||
|---|---|---|
Marque Infineon | ||
Product Type FL-S Flash | ||
Memory Size 256MB | ||
Interface Type SPI | ||
Package Type BGA | ||
Pin Count 24 | ||
Maximum Clock Frequency 133MHz | ||
Cell Type NOR | ||
Maximum Supply Voltage 3.6V | ||
Minimum Supply Voltage 2.7V | ||
Timing Type DDR | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature +85°C | ||
Standards/Approvals RoHS | ||
Supply Current 16mA | ||
Series S25FL | ||
Automotive Standard AEC-Q100 | ||
Infineon S25FL Series FL-S Flash, 256MB Memory Size, 133MHz Maximum Clock Frequency - S25FL256SAGBHI200
This FL-S flash device is a high-density SPI NOR memory intended for demanding embedded and automotive environments. It operates across a wide temperature range suited to harsh conditions and uses a ball grid array package to support Compact board layouts. The device delivers synchronous DDR timing for Rapid data transfer and connects via a serial peripheral Interface for system storage and code execution tasks.
Features and Benefits:
• 256MB memory capacity enables large firmware and data storage
• 133MHz clock rate supports high-throughput read operations
• DDR timing improves effective data bandwidth during transfers
• 2.7V to 3.6V supply range allows flexible power-rail integration
• -40°C to +85°C rating sustains operation in extreme temperatures
• 133MHz clock rate supports high-throughput read operations
• DDR timing improves effective data bandwidth during transfers
• 2.7V to 3.6V supply range allows flexible power-rail integration
• -40°C to +85°C rating sustains operation in extreme temperatures
Applications
• Suitable for automotive control unit code storage
• Ideal for industrial instrumentation firmware retention
• Used with high-speed data-logging systems
• Can be used for boot storage in Compact electronics
• Used for in-vehicle infotainment resource storage
• Ideal for industrial instrumentation firmware retention
• Used with high-speed data-logging systems
• Can be used for boot storage in Compact electronics
• Used for in-vehicle infotainment resource storage
What package type does this device use?
It is supplied in a BGA package to facilitate high-density mounting.
How much current does it draw during normal operation?
Typical supply current is 16mA during Active operation.
Which Interface does it use for communication?
The device communicates over an SPI Interface with DDR timing.
Is the device suitable for automotive qualification?
It meets the AEC-Q100 automotive standard for electronic components.
What regulatory restriction does it comply with?
It is RoHS-compliant for restricted substance adherence.
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